1. 整車控制策略設計/開發 2. 流程文件產出 3. 跨系統功能整合 4. 功能安全分析
1. 新產品導入測試程式&生產設備治具開發準備 2. 產品Image和function驗證& 試產機台Setup 3. 試產治具耗材設備準備 4. CCD&程序撰寫與驗證 5.試產良率監控,異常故障分析處理及反饋,測試數據的收集.産線操作員的培訓.
1.BIOS 研發時程及可行性評估 2.BIOS 規格的制定 3.BIOS 的研發、更新、維護
1. 伺服器BIOS軟體開發及維護 2. 客戶規格審閱 3. 專案問題分析及解決
1. Server BIOS development engineering feasibility estimation 2. Server BIOS engineering specification creation 3. Server BIOS development 4. Server BIOS debug and maintenance
1.x86 platform technology study & planning (specification/documents) 2.UEFI firmware development for projects 3.UEFI firmware debug and analysis root cause 4.UEFI code maintenance 5.OEM e-Module function implement & debug 6 Interdepartmental communication and coordination 7. Support factory
1.BIOS development engineering feasility estimation 2.BIOS product specification definition 3.BIOS engineering specification creation 4.BIOS development 5.BIOS debug and mantainance
〝1.帶領團隊完成BIOS功能開發、除錯及支援工作。 2.跨部門溝通協調,找出解決問題之對策。 3.新技術研發與導入。 4.確保及管控專案研發的進度。〝
1. 產品電性異常分析 2. 產品異常分析與追蹤 3. 產品測試良率追蹤 4. 協助工單關結 5. 零件異常分析 6. 客退品技術分析支援 7. 協助難修品分析 - 大學以上,電子、電機、資工等相關系所 - 5年以上電子消費類產品工廠工程製造經驗尤佳
1.System BOM 2.System Spec 3.System Assembly SOP 4.System Component Approval Sheet 5.System NPI Support (系統階設計、BOM規劃、組裝規劃、Label 規劃、FRU規劃、Cable設計)
1. Cable design and cable routing fitting 2. Board level TAL maintain and system BOM maintain 3. Board level & system assembly SOP design 4. Label matrix design and management 5. Manufacture trouble shooting
1. 軸流風扇評估選用 2. 散熱模組設計並做性能評估 3. 導風罩設計 3. 系統模擬、提供熱流模擬分析報告 4. 系統測試 (熱效能/風洞/噪音) 5. 整理系統測試數據並做問題解析
1. Cable design and cable routing fitting 2. Board level TLA maintain and system BOM maintain 3. Board level & system assembly SOP design 4. Label matrix design and management 5. Manufacture trouble shooting
1. RFP Technical response: Generate H/W Documents as FRU Spec., Qual-Checklist, ProgramIC List, DMI spec., etc… 2. Manufacture Engineering: Technical support/debug for global factories especially for testing. 3. Lead the FA/critical issues & find out the root cause 4. Global EC handling 5. JIRA handle & response 6. New Product Transfer/Enablement into global factories 7. 2nd Source technical evaluation
1. 企業等級WiFi 7 AP router硬體開發 2. IOT 無線相關產品開發
Hardware circuit design, layout, pilot run and debug of telecomm / datacomm products. (xDSL / Router / Switch)
Owner of the Mobile Broadband (5G) Product Line. As the manager of all Mobile Broadband Product Managers, you drive the the creation and execution of an enticing solutions roadmap based on end user needs, market & technology trends. Our 5G solutions range from Mobile Routers and Indoor Gateways to Outdoor Modems and 5G Cameras. As the head of Mobile Broadband Product Management, you target a winning combination of customer satisfaction and profitability.
1. 通訊設備系統研發 2. IPCAM開發 3. 物聯網產品研發(LPWAN GW, module/sensor, IoT platform)
1.IME電子工程開發與評估 2.聲學產品電子段工程開發與評估 3.機構與電子整合產品電子段研發
‘- Serve as a PM for Product Design team. - Working closely with customers and back-end teams to create quality products - Providing design insight and innovative ideas to teams - Supporting customers through out the design and manufacturing stages with organized reports and efficient management of resources.