清大專區

1.Drive R&D and process integration for 2.5D and 3DIC packaging platforms. 2.Lead the development and qualification of new unit modules and device structures. 3.Establish and validate new process flows in Design Start Modules (DSM) to support custom product platforms. 4.Collaborate directly with customers on product requirements, verification testing, and technical solutions. 5.Apply structured methodologies such as FMEA, DOE, and control plans to optimize performance and mitigate risks.

1.Support new customer product introduction into the FAB, ensuring smooth pilot and tape-out processes. 2.Improve yield and ensure stability in in-line, wafer acceptance test (WAT), and chip probe (CP) results. 3.Define and implement standard operating procedures (SOPs) for production. 4.Collaborate with module engineers to resolve production issues related to yield, reliability, and in-line parameters. 5.Work cross-functionally to develop customized process flows that meet customer need.

1.Monitor in-line process parameters, address abnormalities, and make disposition decisions on lots to ensure smooth production flow. 2.Assist in productivity and yield improvement projects through data analysis and process experiments. 3.Support the establishment and maintenance of key process parameters for semiconductor tools. 4.Evaluate new materials, tools, and methods to enhance manufacturing quality and efficiency.

1 了解使用者需求及資訊技術的應用,及各項品質管理,專案管理的技能,以做好系統的日常管理,專案管理,及軟體工程。 2.執行專案及主管交付任務,達成專案目標及日管目標,以滿足客戶需求並符合公司營運需求及提高用戶滿意度 承接部門專案,與相關單位溝通，了解需求,爭取資源,做好專案管理。 處理客戶需求,提供最佳的服務品質與效率 培養技術能力:相關 domain knowledge，軟體工程能力,IT 技術。 改善品質問題,並建立標準流程

1.Monitor and resolve in-line SPC (Statistical Process Control) issues, equipment abnormalities, and lot handling in a timely manner. 2.Maintain equipment capability and ensure availability to meet production demand. 3.Collaborate with production and process teams on tool usage for troubleshooting, maintenance, and output. 4.Participate in troubleshooting and quality improvement projects to enhance equipment reliability and production outcomes. 5.Evaluate new equipment, materials, and retrofits to drive performance gains and production efficiency.

1.Conduct TCAD-based research and simulations to explore novel device concepts and architectures. 2.Develop, document and calibrate TCAD simulation decks in collaboration with cross-functional project teams. 3.Execute TCAD design of experiments (DOE) and generate tuning decks to support device optimisation. 4.Design test keys and layout structures for silicon validation, including bench-level electrical measurements and performance analysis. 5.Run structured experiments to fine-tune device parameters while safeguarding long-term reliability.

1.Day to Day monitoring and ownership to timely address in-line defect abnormality escalation, handling and disposition 2.Render support in Production ramp-up, New process implementation and process characterization for project success 3.Evaluate and implement productivity projects for DM Production, Tool and Cost index improvement 4.Define and deploy inspection tool recipes BKM to ensure detection capability 5.Assist in Customer audits on inspection strategy deployment and execution 6.Perform baseline defect improvement

1.確實推動全方位製程技術研發，以符合客戶產品需求，協助客戶產品開發 2.負責與客戶及FAB各單位之溝通協調，決定工程執行範圍並規劃工程實驗 3.材料分析及元件電性分析，蒐集製程技術相關文獻，並加以整理與報告 4.解決及分析製程及產品重大問題，推動產品量產進度 5.協助主管檢視計劃執行進度工作成果，指導新進工程，並回報工作狀況 6.依Project製程技術開發之工作目標與時程，規劃細部執行計劃

1.Lead the development of advanced RFSOI and RFSOI-3DIC technology platforms for next-generation communication solutions. 2.Design and qualify new process modules and RF device structures to enhance platform capability and performance. 3.Establish and validate new process flows in Design-Start Modules (DSM) for customer-specific applications. 4.Collaborate closely with customers on new product verification, process customization, and technical alignment. 5.Coordinate cross-functional activities from design to qualification, ensuring robust integration and yield performance.

1.Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions. 2.Collaborate with internal R&D and module engineering teams to define and execute SiPh process flows. 3.Align device and process requirements with customers through technical discussions and solution deep dives. 4.Coordinate with external OSATs and partners for PIC/EIC characterization and packaging integration. 5.Apply DOE, FMEA, and control plan methodologies to ensure robust development and effective risk mitigation across all phases

1.New Device Introduction: Perform tape-out/tooling operations for customer design database and achieve the goal of first pilot success. 2.Project coordination: Customer interface and cross department coordination with seamless communications. 3.Manage conference calls, meetings and customer visits with professional presentation skills and logistics arrangement for project success. 4.Project management: Documentation, summary, meeting minutes and ability to recap keynote of meetings for management team review.

1.Work with cross-functional teams from Process Integration, Modelling, PDK, and Design Enablement to develop advanced BCD (Bipolar-CMOS-DMOS) technologies for 300mm fabrication. 2.Lead technical engagement with consumer and automotive customers to understand and define device requirements. 3.Generate BCD active and passive device P-cell layouts based on application specifications. 4.Collaborate with the Modelling team to develop accurate SPICE models. 5.Drive implementation of specialised device features into PDKs and ensure timely communication and technical validation with customers. 6.Enhance BCD device performance to meet evolving application needs.

1.負責活期存款存提款及轉帳業務。 2.辦理各項掛失止付業務。 3.辦理客戶定存設定、定存質借、質權設定等業務。 4.負責全分行的資金調度及現金收付業務。 5.負責國內匯兌業務。

1. Chiller冰水機操作及例行檢修、測試 2. 管理ISO9001品質管理系統 (需熟悉ISO9001) 3. 不良品分析 FA/CA/PA report 4. 提升單位組織與QC教育訓練 5. 具有五年QC經驗、半導體經驗佳 6. 完成主管交辦事項

1. 工廠品質監控與源頭改善 2. 品質退貨分析與改善 3. 改善檢測方法 4. 新產品偵測能力評估與檢測結果分析 5. 專案執行/管理

＼無經驗可！月薪41K起，上看80K／ 【半導體產業龍頭，技術先行者】 ★薪優福利多！年薪上看14~24個月，再享員工分紅 ★安心好食在！免費供餐，多元美食任你挑選 ★暖心好照顧！豐富社團活動、旅遊津貼、2000家特約商店！ Bumping & WLCSP F/E 黃光&白光&AOI&CoWoS 工作內容: 1.新產品導入量產驗證、製程改善 2.生產流程異常處理、分析、規範制定 3.專案管理執行與規劃 4.客戶服務、技術支援 5.主管交辦事項

1.整理客戶報告、資料分析(excel樞紐、vlookup) 2.文書彙整與報表建立 3.協助工程業務執行 4.其他主管交辦事項

(1) 電力/消防/弱電/空調/氣體/FMCS/廢水/排氣/集塵/供水/土建之運轉及維護。 (2) 協助進行機電/空調/環工等系統之擴建工作。

1.負責測試設備硬體架設與整合，確保探針台（Prober）與 ATE 系統完美匹配。 2.針對高頻、高速訊號晶片進行精密調校，追求極致的測試穩定度與良率優化。 3.機透過數據分析與機況報告，診斷設備異常（Root Cause），並提出創新的改善方案。 4. 協助導入 CPO (矽光子) 測試製程，克服光路對準與高精密電性量測的挑戰。

1.協助規劃產品流程所需技術及設備參數評估 2.製程生產參數之測試及驗證 3.製程能力及製程管制規格制定 4.製程良率改善及提升