交大專區
職責要求 1.EC/MCU Development, maintaining existing codebase and resolving issues 2.Provide technical support to internal team member and customer 3.Willing to work in a dynamic and fast-paced environment 任職資格 1.Have experience with the development on low-level protocol, such as I2C, SPI, UART, GPIO 2.Understanding platform root of trust 3.DataSheet and Spec study experience 4.Knowing how to use encryption and decrytion algorithm
1. Field support to all customers in the Northern part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events; is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.
1. Tool installation and service support based in Taichung but not limited to work in Taichung area. 2. Preventive maintenance on Photo-Mask Equipment. 3. Participate on service review meetings at customer site. 4. On-call duty at night and weekend is required on rotary base. 5. Windows operation system skill is required for tool software update. 6. Obligate to learn new products and training on new tool abroad. 7. Assistance in application and sales to promote products. 8. Other service task assigned by management.
職責要求 > Need to visit customer sites to perform SW installation, upgrades and troubleshooting. > Strong analytical and debugging skills to identify and resolve software and hardware issues on-site. > Ability to adapt quickly to unexpected challenges in the field. > Effective communication skills to explain technical concepts to non-technical audiences. > Proactively collect field issues and work with engineering SW dept. to find solution I the filed. 任職資格 1.Technical Skills: • Knowledge of C++, Visual Studio programming and PLC programming • Knowledge of relevant SEMI standards (e.g. SECS/GEMS) 2.Field Experience: • Ability to work in dynamic environments, including on-site installations, testing, or support. • Experience interfacing directly with customers to gather requirements and provide technical solutions.
1. 各項專案進度控管 2. 制定新產品和技術發展策略,追蹤市場需求和技術趨勢。 3. 指導產品方案制定,保證實用性和技術創新。 4. 領導技術團隊,執行開發進度和人力管理。 5. 建立組織架構,監督產品研發成效,提高市場競爭力。 6. 推動工程技術人才培養,提升團隊技術水準。
1. Android 系統 : ◆ 熟悉 Android 操作系統架構,包括 Linux內核、Android 系統服務、應用框架、HAL(硬體抽象層) ◆ 理解 Android 的啟動過程、運行時環境以及如何調整和定制內核與系統配置。 2. Linux : ◆ 深入理解 Linux 內核因為 Android 是建立在 Linux 內核上的。包括內核驅動程式、內核模塊、內存管理、中斷處理、文件系統、進程調度等方面 ◆ 能夠配置和編譯內核,調整內核設置以支持特定硬體平台。 3. 硬體 : ◆ 熟悉不同硬體平台的架構(如 ARM、x86、MIPS、RISC-V 等),包括處理器、內存、外圍設備(如顯示器、攝像頭、網絡接口、傳感器) ◆ 能夠閱讀硬體數據手冊,理解硬體如何與操作系統交互,並根據需求修改或編寫硬體驅動程式。 4. 硬體抽象層(HAL)開發 : ◆ 熟悉 Android HAL 層的設計和實現,能夠根據硬體需求實現或修改硬體抽象層接口(如相機、音頻、GPS 等硬體驅動) ◆ 能為特定硬體設備開發 HAL 模組,使得 Android 操作系統可以無縫支持這些設備。 5. Android 編譯系統 : ◆ 熟悉 Android 編譯系統(如 AOSP,Android Open Source Project),能夠使用 repo、make 和 Gradle 等工具進行源代碼編譯、配置和打包。 ◆ 能夠配置和定制 Android 內核、系統映像、應用框架等,以滿足硬體要求。 6. 引導程式(Bootloader)開發與配置 : ◆ 熟悉 引導程式(如 U-Boot、Fastboot)的工作原理,並能夠調整或修改引導程式以支援新的硬體平台。 ◆ 確保操作系統能夠從引導階段順利啟動,包括處理分區、內核加載和設備初始化等。
職責要求 1. 在車用系統帶起WiFi/BT模組 2. 在不同的SOC平台移植驅動 3. Linux或Android車用系統整合 4. 須與其他部門合作(ex:硬體、framework team...) 任職資格 1. 熟悉C語言 (有kernel driver相關經驗者佳) 2. 熟悉Linux (主要開發環境)、Android (部分用到)
職責要求 1. 移植藍牙驅動,並帶起藍牙模組。 2. Linux 車用系統藍牙協議/應用的開發。 3. Linux 藍牙協議問題解決。 任職資格 1.熟悉C語言、Linux
職責要求 1. 移植藍牙驅動,並帶起藍牙模組。 2. Android車用系統藍牙協議/應用的開發。 3. Android藍牙協議問題解決。 任職資格 1.熟悉C語言、Android
1. 車載產品 電路/Layout 設計 2. 熟悉車載 EMC/EMI 試驗 相關設計 3. LED類相關產品尤佳
職責要求 1. 能獨立完成系統分析、設計、開發。 2. 具有集團資訊系統開發/維護經驗。 3. 具有系統相關文件撰寫經驗。 任職資格 1. 具物件導向分析與設計概念 (OOAD) 2. 熟 C# 語法 及 ASP.NET、MVC.NET 3. 熟悉前端網頁技術 HTML、JS、CSS, 有前端程式框架經驗佳,如 Vue.js 4. 熟 MS SQL Server 及資料庫存儲、物件 (Entity Framework) 5. 具有系統分析/設計、專案管理經驗佳
1.工程品質查核及物料管理。 2.文書製作、監工日報填寫與數量核算。 3.請款計價作業審核製作。 4.配合上級主管交辦事宜。
職責要求 1. 醫療器材開發前設計概念發想及技術可行性評估 2. 醫療器材整機或模組機構規劃,風險分析,設計,開發及驗證 3. 醫療器材先期評估、風險分析、設計、開發、驗證、量產導入之相關文件製作 4. 針對特定工程主題蒐集相關機構知識,進行專業分析 5. 協助產線解決量產中製造及製程中的機構相關問題 任職資格 1. 負責內視鏡之主機開發 2. 具備10年以上產品機構設計經驗(設備機構類別不考慮) 3. 具備3年以上管理經驗 4. 能配合海外出差 5. 英文-須能與海外客戶開會口語溝通 6 碩士學位以上
職責要求 1.建置與總公司資訊系統介接之infrastructure,並評估更適合業務貿易型態運作之高效率作業系統 2. Build up Off-site office,Video conferencing system 3. Introduce PM tools to help supervisors monitor and control progress of each project. 任職資格 1.熟悉貿易與廠務資訊系統經驗者 2.熟悉各代程式語言汰換與新舊系統架構
職責要求 • 對市場和用戶有深入的了解,能夠洞察用戶需求和市場趨勢。 • 從產品整體的角度思考問題,能夠提出創新的產品方案。 • 競品研究分析, 定義產品目標、功能需求 • 負責平台的前台網站與後台的功能規劃、wireframe設計及PRD的撰寫。 • 負責產品開發過程中的進度管理與追蹤,保證產品質量以及測試工作順利進行,解決開發過程中遇到的問題。 • 負責管理產品生命週期、追蹤及分析產品使用情況,並持續維護及改進已上線產品的用戶體驗。 任職資格 • 具良好溝通協調能力,能受改變與挑戰。 • 有責任心,高抗壓能力和執行力,有較強的主動參與意識,自主學習能力強。 • 英文精通
1. Field support to all customers in the Northern part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events; is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.
1. Field support to all customers in the Hsinchu part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events; is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.
1. Tool installation and service support based in Hsinchu office but not limited to work in Hsinchu area. 2. Preventive maintenance on Photo-Mask Equipment. 3. Participate on service review meetings at customer site. 4. On-call duty at night and weekend is required on rotary base. 5. Windows operation system skill is required for tool software update. 6. Obligate to learn new products and training on new tool abroad. 7. Assistance in application and sales to promote products. 8. Other service task assigned by management.
• Conduct and complete final acceptance test at customer site. • Establish process and qualify bonding systems with customer. • Collaborate with customer in defining problem statements, analyzing abnormal data, resolving process issues, and improving process conditions. • Provide both on-site and remote applications support to customers. • Participate in customer meetings and maintain positive relationship with customer contacts. • Provide expertise and advice to bonder business unit to help product improvement. • Participate in projects related to new product introduction: definition, characterization, alpha testing, beta testing and customer use case development • Learn new products through daily work and training events; is required to attend training events upon arrangement. • Take ownership of application projects assigned by supervisor. • Other tasks are assigned by supervisor
職責要求 - Lead and manage application engineering teams focusing on lithography and wafer bonding technologies for semiconductor advanced package fabrication. - Provide technical expertise and support to customers in Taiwan regarding the usage and optimization of equipment, including mask aligners, coaters, developers, and wafer bonding tools. - Collaborate with R&D teams to implement customer-specific solutions, improving product performance and enhancing customer satisfaction. - Drive the development and integration of new processes for 3D packaging, TSV (Through-Silicon Via) bonding, and other advanced semiconductor applications. - Conduct customer training sessions, troubleshooting, and technical support to ensure optimal equipment performance. - Oversee process validation and testing, ensuring compliance with industry standards. - Regularly interface with customers to understand their challenges and tailor solutions that meet their needs. - Stay updated on the latest industry trends and technical advancements, ensuring the company‘s offerings remain competitive. 任職資格 - Master’s degree in Engineering related field or Material Science. - Minimum 6 years of experience in semiconductor lithography and bonding processes. - Minimum 3 years of team management experience. - Strong problem-solving skills, with the ability to troubleshoot technical issues in semiconductor processing. - Excellent communication and interpersonal skills to effectively interact with customers and cross-functional teams. - Fluent in English; knowledge of Mandarin is an advantage.