交大專區

1. 負責公司網路基礎設施的設計、部署和最佳化，包括三層網路模型、 TCP/IP協定、VXLAN、OSPF、BGP等； 2. 設計與實作資料中心網路架構，優化資料中心內外網路的拓樸結構及解決 方案 3. 負責網路監控和效能最佳化，熟悉並能夠使用 Zabbix / Prometheus 等工具進行網路狀態監控和警告配置； 4. 管理並最佳化虛擬化平台，具備 VMware / Hyper-V 等虛擬化軟體的實 務經驗。

1. NB、 PC embedded controller程式開發、除錯、維護。 2. 協助產線改善生產品質、良率及客訴問題。 3. 具強烈學習能力及工作意願，熟C語言及組合語言者佳。

Job Summary: We are seeking a highly skilled and experienced Advanced System Architect to join our team. The ideal candidate will possess a broad understanding of various technology domains and a proven track record of designing and implementing complex, scalable, and reliable system architectures across multiple product lines. This role requires a strategic thinker with strong leadership and communication skills, capable of driving innovation and ensuring technical excellence. Responsibilities: • Design and develop comprehensive system architectures that align with business objectives and technical requirements across diverse product lines. • Collaborate with product managers, engineering teams, and stakeholders to define system requirements, evaluate technologies, and develop architectural roadmaps. • Lead technical evaluations and proof-of-concepts (POCs) to assess the feasibility and viability of new technologies and solutions. • Provide technical leadership and guidance to engineering teams, ensuring adherence to architectural standards and best practices. • Identify and mitigate technical risks and challenges, ensuring the stability, performance, and security of our systems. • Research and evaluate emerging technologies and industry trends, and recommend innovative solutions to enhance our products and services. • Develop and maintain architectural documentation, including diagrams, specifications, and design patterns. • Participate in cross-functional initiatives and contribute to the continuous improvement of our development processes. • Work with customers to understand their needs, and to produce optimal solutions. Qualifications: • Bachelor‘s or Master‘s degree in Computer Science, Electrical Engineering, or a related field. • Minimum of 10 years of experience in1 system architecture, software development, or related technical roles. • Extensive knowledge of server hardware architecture, cloud computing, virtualization, data center infrastructure, and network security. • Proven ability to design and implement complex, scalable, and high-performance systems. • Strong understanding of software development methodologies, design patterns, and best practices. • Excellent communication, presentation, and interpersonal skills. • Ability to lead and mentor engineering teams, and to collaborate effectively with cross-functional stakeholders. • Strong problem-solving and analytical skills. • Experience with a broad range of technologies. Preferred Qualifications: • Experience with AI/ML infrastructure and technologies. • Experience with embedded systems. • Experience with advanced cooling solutions. • Experience with PCIE Gen5, and CXL.

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for high-performance computing. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

1. 產品前期規劃 & RFQ (NB/DT/AIO) 2. POC : 新技術/結構/材料製程研究 3. 分析市場產品

1.NB/DT產品的 Power 設計方案建議以及研討。 2.Power零件建議以及線路 Review. 3.進行Power的 Layout Placement and Traces Routing review. 4.需跨單位(如 EE/ME/RF/Thermal..)進行專業溝通以及合作. 5.新機種的RFQ proposal撰寫以及現場報告。

1.協助客戶對供應鏈相關資料的提供-專案如期完成 2.協助FP系統開發與維運-日常出貨作業順利 3.協助客戶對供應鏈相關資料的提供-滿足客戶需求

1. 伺服器產品結構CAE設計分析 2. 伺服器產品結構振動衝擊測試

1.Cobot 手臂、無人車、4足/2足/輪式 機器人系統功能測試，整合測試，系統Benchmarking 測試性能和無線網路測試。 2.無人車車隊管理系統 edge 端、雲端系統佈建、整合測試，功能設置，支援工廠測試和導入計畫。 3.學習新技術，學習對應的測試案例，創建測試計畫。對新人進行培訓。 4.有效管理測試任務、資源規劃與分配。問題的管理與追蹤，跨團隊合作，加速問題的解決及澄清。 5.匯總測試報告並追蹤測試進度。風險評估與管理。與原廠或客戶充分溝通，瞭解並滿足測試需求。

1. 工業工程/工業管理/資管理工/機械相關科系學士以上。 2. 須具備職場工作實務經驗5年以上，須具備管理系統、開發規格、領導佈署的統籌能力。 3. 口齒清晰，可英文溝通，有多益成績單者750分以上。 4. 個性開朗，遵守組織規範，可配合國外出差。 5. PMP國際專案管理證照者或其他專案管理證照尤佳。若無則必須有管理案例實戰經驗。

1. 大專理工相關科系畢業。 2. 開發自動化系統開發實務經驗5年以上。包含自動化設備使用、設計、機器視覺使用、3D機構設計等的相關經驗都能算在內。 3. 開發系統規格、設計、驗收、測試、分析問題、佈署監控、管理專案有興趣者。 4. 英文成績多益650分以上。 5. 有紀律、邏輯清晰、善於團隊溝通。 6. 能配合國外出差，時間三個月內。

1. 執行信號模擬分析，評估訊號完整度。 2. 分析Chip Vendor Recommend Routing Guide。 3. 建立Constraint Rule for PCB Routing。 4. 設計PCB疊構以符合特性阻抗需求。 5. 研究訊號完整性專業技術之提升。 6. 量測實體PCB特性阻抗驗證品質。

1.PCB stack-up design & Constraint Rule setting. 2.Provide SI/PI design suggestions for PCB layout. 3.Signal integrity analysis of high-speed and low-speed signal interfaces. 4.Power integrity design includes DC impedance, AC resonance and capacitance optimization. 5.In addition to Cadence 2.5D EM solution as a daily necessary software, AMD SeaSim/S2Eye, Intel ICAT/IMLC/CCT are also required. 6.Use TCL and Python to shorten the complicated software operation process, generate reports and perform DOE analysis. 7.Familiar with PCB test coupon TDR/TDT measurement and Delta L 4.0 Measurement.

1.參與-資料安全設計-資料被安全的存取 2.協助-內部系統資料串接-將AI與公司內部資料有效整合 3.參與-AI資料治理-資料能有效管理與運用 4.協助-新技術評估-運用新的技術提升資料管理效率

我們正在尋找對流程自動化有興趣的 RPA工程師，加入我們的團隊， 一起用 RPA 與 AI 解放大家的時間與想像力！主要的工作內容如下: 1. 與各部門合作導入流程自動化，優化作業流程、提升效率 2. 分析現有流程，設計並開發 RPA 機器人（如 UiPath、Power Automate） 3. 維護與優化自動化流程，處理錯誤並提升執行穩定度 4. 撰寫流程設計文件與操作手冊，協助團隊落地執行 5. 協助評估導入效益，整理分析數據與報告 6. 參與 RPA 結合 AI 的應用開發，讓流程更智慧、更高效

1.協助-雲平台管理維運-InStella系統穩定運作 2.參與-InStella前後端開發-InStella新功能上線 3.協助-API管理-API穩定與內外部系統串接 4.參與-CI/CD導入-提升團隊開發效率

我們正在尋找對流程自動化有興趣的 RPA工程師，加入我們的團隊， 一起用 RPA 與 AI 解放大家的時間與想像力！主要的工作內容如下: 1. 與各部門合作導入流程自動化，優化作業流程、提升效率 2. 分析現有流程，設計並開發 RPA 機器人（如 UiPath、Power Automate） 3. 維護與優化自動化流程，處理錯誤並提升執行穩定度 4. 撰寫流程設計文件與操作手冊，協助團隊落地執行 5. 協助評估導入效益，整理分析數據與報告 6. 參與 RPA 結合 AI 的應用開發，讓流程更智慧、更高效

我們正在尋找對機器人技術充滿熱情的軟硬體整合工程師，負責開發並優化我們的智慧化機電系統的整體系統架構。您將有機會參與前沿技術的研發，推動產品的創新與進步。 工作內容： 負責機器手臂與小型無人車的嵌入式系統與韌體開發。 進行感測器數據的擷取與處理，並實作相關的軟體邏輯控制。 確保軟硬體模組之間的順暢整合，優化系統效能與穩定性。 與跨部門團隊緊密合作，將產品需求轉化為可行的軟硬體解決方案。 參與系統故障排除與性能優化，確保產品穩定可靠。

1.Design and implement system software of embedded devices. 2.Optimization and customization for kernel driver feature. 3.Customization for HAL / Driver in Android OS. 4.Implement tool for testing requirement for ODM/OEM. 5.Integrate 3rd party/in house/open-source algorithm to different platform. 6.Analyze system performance issue. 7.Customization for SOC chipset driver. 8.Review BSP issues.

1. Intel / Qualcomm Sensor Hub 及 AI Sensor 韌體問題分析、功能導入與支援 (issue analysis, feature enabling)。 2. 研發與學習 Intel / Qualcomm Sensor Hub 及 AI Sensor 相關新功能之應用。 3. 跨部門、客戶端及供應商之 Firmware / Software 相關事宜溝通協調。