研發替代役專區

1. 食材採購 + 處理 2. 午餐.晚餐 烹飪 (一般中式料理與簡易日式料理)

1.配合送貨，倉庫整理，車輛保養，需搬運貨品 2.需具大貨車駕照 3.具3噸以上移動式起重機證照尤佳 4.需會駕駛10噸半吊車 5.如無起重機證照，可依公司規定協助考取。

生產製造螺絲,操作機械五金

一、依據照顧計畫予個案管理服務，每月執行家訪或電訪。 二、協助個案資源連結。 三、居家服務員之督導與管理。 四、居家服務行政事項。 五、其他交辦事項。

我們是旋轉接頭專業製造廠商。 工作內容: 1. 主要繪製機械零配件，機械相關科系佳。 2. 須具備需熟練 AutoCAD 或 Solidworks 繪圖軟體操作能力。 3. 實際製圖2年以上經驗。 4. 新進人員需至生產部門進行產品認識、了解製程的短期訓練。 5. 具備小型汽車駕照佳。

1.負責顧客帶位、點餐及現場服務 2.餐點擺盤、送餐及內外場聯繫 3.餐後收拾碗盤及環境清潔 4.協助簡易餐點製作（提供教學） 5.結帳及收銀作業 【職務條件】 1.具服務熱忱、喜歡與人互動 2.對餐飲服務工作有興趣 3.具責任感、配合度佳 4.無經驗可、願意學習 5.可配合門市排班（含假日） 【工作時間】（排班制） 09:00－14:00 11:00－14:00 17:00－21:00 18:00－21:00 21:00－23:00 21:00－01:30 (實際排班依門市需求安排）

我們是一家專注於提供優質芳療服務的機構，致力於透過身心靈的平衡達到健康與幸福。我們的主要服務對象為注重健康、美容及放鬆的人群，提供包含多項專業服務如臉部護理、身體按摩及芳療技術，竭力為客戶帶來高品質的舒適體驗。 工作內容： 1. 執行專業的芳療Spa技術操作，包括臉部護理、身體按摩及歐式Spa。 2. 利用臉部撥筋、無痕清除粉刺、身體保養及手足理療等技術，幫助客戶維持肌膚健康並促進放鬆。 3. 掌握精油芳療及熱石療法，協助客戶身心調節及緩解壓力，提供療癒服務。 4. 定期參加內部專業技術培訓，提升個人技術水平與服務品質。 5. 確保工作環境整潔衛生並協助維護設備，符合職場安全及衛生標準。 6. 提供專業諮詢，針對客戶皮膚狀況及需求，推薦合適的療程與居家護理建議。 7. 協助銷售相關美容產品，解答客戶問題並提升銷售業績。 8. 適應公司調派，在全台分店依排班工作。 公司注重員工職涯發展，按照職能評核您的工作表現，提供階段性晉升機會（芳療師、底薪調整、工作加給及獎金）。 歡迎對美容及芳療服務充滿熱忱的您加入我們，即使是無經驗者，我們也會提供完善的職前培訓，讓您成為專業的沙龍美療芳療助理！立即投遞履歷，期待您的加入，共同創造舒適健康的生活美學！

MisterDonut為全台最大的連鎖甜甜圈專賣店 ֍統一集團最優質品牌、合法企業 ֍喜歡餐飲、烘焙甜點的你 ֍想學一技之長的你 ֍想在一個歡樂環境工作的你 歡迎一起成為我們的【圈內人】 【工作說明】 ◎基礎作業：開閉店作業、收銀、甜甜圈裝飾加工包裝、商品介紹、飲品製作、門市清潔。 【打工超方便 】 ★選擇地點多: 交轉運據點、商場/百貨/量販店。 ★選擇班次多: 早中晚三班次，可依課表與店長面議。 ★每週排休2天，另有特休假。 【福利制度】 ★調薪機會：每半年會考核一次，工讀生也會有調薪機會喔! ★最真實的關心：每年免費健康檢查、免費員工團體保險 ★就是比別人多一：春節、五一、端午、中秋 四好禮。 ֍生日我最大：生日禮物。 ֍其他沒講的：婚喪喜慶。

1.包裝、生產食物醬料產品 2.生鮮物料處理分裝作業 3.學習能力快，有產線經驗者佳 4.執行作業區環境整理，清潔維護作業 5.手腳俐落，需對自己要求工作效率及速度 6. 完成主管交辦事項 ★月薪29500元+全勤1,000元+伙食津貼1天100元(需無遲到早退) ★另有證照加給、技術、操作獎金...等(沒證照公司輔導考照喔!)

1‧供應商管理。 2.產品管理，Forecast彙整 。 3.帳務管理。 4.有談判議價、開發新品經驗者。 5.有國外進口採購船務實務經驗者。

公司連絡電話：02-29001530黃小姐，預約面試時間。 📦【倉管人員】誠摯招募中！ 🔧 你的工作內容 1. 依照生產程序，操作填充棉花並完成產品包裝 2. 辦理貨物整理、協助維持秩序井然的倉儲環境 3. 進出貨管理、搬運、整理 4.廠區遵守規範：禁菸、無檳榔，打造健康工作環境 熱情的我們期待你的加入，讓團隊因你變得更棒！ 快來聯絡我們，和我們一同創造感動吧！

Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

***Please upload English resume onto our official platform: https://reurl.cc/qpRoqg Job Description - To work with operation/maintenance to ensure production smoothly. - To assist action confirmations with system monitors. - To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: - Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures - Bachelor‘s or Master‘s student in Material/Science/Electronic Engineering or related - Available to work at least 3 days/week. - Good verbal and written English communication skills - MS Office or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

***Please upload English resume onto our official platform: https://reurl.cc/Em0W00 Job Description - To work with IT and Equipment/Production team for MMS (Machine Maintenance Solution) spare part and tool management system build up - To assist Automation project of introducing AMHS (Automatic Material Handling System) for product transportation from wire bond stage to molding stage. Qualifications: - The candidate must be pursuing a Bachelor’s or Master’s degree in Mechanical/Electronic Engineering or related. - Available to work 3 days/ week. - Good verbal and written English communication skills - MS Office, AutoCAD or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

Job Description -　Main contact window with business lines (BLs) to deliver a high quality and manufacturable product for IC test production, meeting or exceeding the required time to market or product cost. -　Take lead of new product introduction (NPI) for IC test -　To coordinate with related BLs (business line) and align with wafer/final test factories to prepare the product transfer -　To improve new product introduction procedure to enable smooth product transfer -　To reduce risk and impact to customers and factories, escalation management, e.g. reduce risk and impact by right and timely escalation -　To ensure no gap on test tooling availability Facilitate IC test data review and process for planning forecast, take responsibility on test technical data (and improvement plan) in time and accuracy -　To follow up test improvement projects, hold lots, progress of New Product Introduction, test buy off…etc. -　Process of Test Engineering Notice and Enovia ECO Requirement -　Bachelor degree (or above), Engineering background is preferred. -　Excellent communication skills (English/Mandarin, TOEIC＞600) -　Good logic thinking -　Be familiar with MS Office tool -　1 yrs experience in IC testing or related working experience is preferred

Job Description - Ensure compliance with Taiwan electrical regulations, SEMI standards, and safety codes. - Manage and maintain facility electrical systems, including: High/low voltage distribution (HV/LV), Switchgear, transformers, UPS, and generators. - Proficient in AutoCAD for electrical drawings and single line diagrams - Strong knowledge of high-voltage power systems, including: Protective relay operation, Single line diagram development and interpretation, Familiar with motor control systems. - Handle emergency response for power-related incidents and recovery planning. - Ensure power reliability and quality to support critical manufacturing tools - Monitor and improve system performance, capacity, and efficiency. - Lead preventive maintenance (PM), especially annual electricals PM activity and troubleshooting for power systems. - Coordinate power system upgrades, expansions, and projects - Support new tool installation(Hook-up) and capacity ramp-up planning. - Analyze power consumption and drive energy-saving initiatives. Qualifications: - Bachelor‘s degree or above, preferable in Electrical Engineering - At least 5+ years of experience in industrial or semiconductor facilities. - Relevant certifications is a plus. (Electrical Engineer license, HV certification, etc.) - Familiar with PLC operation and basic control logic is a plus. - Experience in Energy Management Systems (EMS), such as ISO 50001, and HVAC systems is a plus.

Job Description 1. Ensure high-quality and accurate implementation Responsible for FDC/ADC model setup based on solid process knowledge and failure analysis experience, ensuring model accuracy and minimizing rework. 2. Manage and reduce configuration risks Configure monitoring logic, thresholds, and rules to effectively distinguish true signals from noise, reducing false alarms and missed detections that may impact production. 3. Drive efficient project execution Ramp up on systems and processes, minimizing trial-and-error to ensure timely and effective implementation of FDC/ADC projects. 4. Collaborate across cross-functional teams Work closely with Process, Equipment, Manufacturing, and IT teams to align objectives, communicate technical insights, and drive decisions efficiently. 5. Support yield improvement and operational performance Leverage monitoring systems to enable actionable insights that contribute to quality improvement, yield enhancement, and manufacturing efficiency. 6. Ensure project continuity and long-term ownership Demonstrate strong role clarity and accountability, supporting stable system operation, continuous improvement, and sustained project ownership. Requirements: Basic Qualifications: - At least 2 years of working experience in semiconductor manufacturing, preferably as a Die Attach Process Engineer. - Master‘s degree or above in engineering-related disciplines, such as Electrical Engineering, Mechanical Engineering, Materials Science, or Chemical Engineering. Technical and Analytical Skills: - Solid knowledge of process control, yield analysis, defect reduction, and continuous improvement methodologies. - Candidates with a statistics-related background are preferred, with the ability to apply data analysis techniques to process monitoring and improvement (e.g. SPC, Cp/Cpk, GR&R, MSA). - Hands-on experience with FDC (Fault Detection & Classification) and ADC (Automatic Defect Classification) applications, capable of utilizing process and equipment data for abnormal detection, trend monitoring, and early warning. - Experience in process automation applications, able to support system- or equipment-level automation projects to enhance process control and reduce manual operation risks. Quality and Customer Interface Experience: - Experience in customer complaint handling and root cause analysis, familiar with structured problem-solving methodologies such as 8D, 5 Why. - Ability to work effectively with cross-functional teams (Process, Quality, Equipment, and Suppliers) to drive corrective and preventive actions. Communication Skills: - Good written and verbal English communication skills, capable of effective interaction with customers, suppliers, and internal teams. - English proficiency equivalent to TOEIC 600 or above. Systems and Manufacturing Knowledge - Ability to leverage system and automation data for process tracking, lot history review, abnormal analysis, and continuous improvement activities.

Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing

Role Summary: The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies, enabling new product creation company-wide. Job Responsibility: －Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications. －Establish qualification requirements for new technology and product introduction. －Perform rigorous statistical analysis of reliability characterization data. －Enable high reliability during volume production by working with product groups to address risk areas. －Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues. －Communicate study conclusions and recommendations to internal and external teams. Job Qualification: －Bachelor‘s, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 10 years of industry experience. －Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio). －Software development experience, such as familiarity with microcontroller software development (C/C++) is desired. －Interest in statistics and solid-state device fundamentals, especially as applied to emerging non-volatile memory technologies like MRAM and RRAM. －Must be curious, proactive, and detail-oriented. －Able to work in a team environment, communicate effectively in English and Mandarin, and solve problems.