交大專區

*車床、銑床、研磨加工相關工作。 *加班費另計。

*拋光、電鍍加工相關工作。 *加班費另計。 *其他依公司規定。

1.Spice model generation and verification for advanced and specialty technologies 2.Spice Model Parameter Extraction 3.Test key design 4.Internal and external customer support 5.Advanced modeling tools, extraction algorithms and model equation benchmarking

1.製程開發執行, 新技術開發之時程掌控，以符合製程整合新製程開發之需求，提高客戶之滿意度 2.開發模組製程, 使先進製程良率達到量產需求 3.維持製程穩定度, 降低製程缺陷數目及提高機台妥善率 4.線上異常處理及後續成效追蹤 5.建立標準規範(SOP)，改善現行系統漏洞 6.突破性製程研發改善，提高公司競爭力

負責 eNVM IP 開發 1.負責標準eNVM IP　電路模擬及驗證 2.負責Verilog Model 產生及驗證以確保品質 3.負責Testchip 電路設計及模擬，驗證 4.負責 Data Sheet 驗證以確保品質

1.確實執行全方位製程掌控，以符合客戶產品需求，提高客戶滿意度. 2.整合各Module建立process flow，以符合客戶產品需求. 3.產品良率維持/提昇，以降低客戶die cost，提高客戶滿意度. 4.WAT電性參數SPC monitor (real time)，keep process quality. 5.Customized/New process development，滿足客戶需求品質issue分析/解決，即時改善異常.

(1) 擬訂教學計畫。 (2) 課程發展與管理。 (3) 整理教學資料、製作教具、編訂教學活動及設計教案。 (4) 向學生教授相關學科知識，並維持課堂上的秩序。 (5) 批改學生作業。 (6) 運用適當教學策略與方法，指導學生學習。 (7) 負責訓育、輔導學生工作及學生支援，包括融合教育、生涯規劃教育等。 (8) 進行教學評量並實施增廣或補救教學。 （僅接受書面報名） 3.甄選簡章及報名表請至本校公告自行下載 (https://www.tmsh.tc.edu.tw/ischool/publish_page/9/?cid=7519) 寄至 427 台中市潭子區潭興路一段168號 人事室收

1.執行統計大數據分析與開發資料科學演算法及設計與訓練深度學習模型，並運用技巧調適模型，使其具備最佳的預測能力。 2.利用深度學習模型開發系統雛形，並驗證可以提升廠內人員生產力，機台產能，產品良率，與降低產品 cycle time. 3.開發AI新技術與研發 AI 關鍵零組件，專案執行，產學合作

1.元件設計及開發 2.元件特性開發量測及評估 3.電腦輔助元件設計 4.Testkey設計及分析

提供客戶工程解決方案，提升客戶工程服務滿意度 1.承接業務需求, 導入並完成客戶專案(包含新客戶或新產品) 2.配合業務發展,不定時結合內部開發成果,主動提供客戶技術需求及解決方案,確保客戶競爭力 3.整合內部資源,提供客戶產品開發所需之工程服務 4.協助客戶產品順利進入量產, 整合工程資源,持續提升產品良率 5.完成產品Tape out及Pilot相關事宜

1.確實推動全方位製程技術研發，以符合客戶產品需求，協助客戶產品開發 2.負責與客戶及FAB各單位之溝通協調，決定工程執行範圍並規劃工程實驗 3.材料分析及元件電性分析，蒐集製程技術相關文獻，並加以整理與報告 4.解決及分析製程及產品重大問題，推動產品量產進度 5.協助主管檢視計劃執行進度工作成果，指導新進工程，並回報工作狀況 6.依Project製程技術開發之工作目標與時程，規劃細部執行計劃

1.Lead the development of advanced RFSOI and RFSOI-3DIC technology platforms for next-generation communication solutions. 2.Design and qualify new process modules and RF device structures to enhance platform capability and performance. 3.Establish and validate new process flows in Design-Start Modules (DSM) for customer-specific applications. 4.Collaborate closely with customers on new product verification, process customization, and technical alignment. 5.Coordinate cross-functional activities from design to qualification, ensuring robust integration and yield performance.

1.Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions. 2.Collaborate with internal R&D and module engineering teams to define and execute SiPh process flows. 3.Align device and process requirements with customers through technical discussions and solution deep dives. 4.Coordinate with external OSATs and partners for PIC/EIC characterization and packaging integration. 5.Apply DOE, FMEA, and control plan methodologies to ensure robust development and effective risk mitigation across all phases

1.Drive R&D and process integration for 2.5D and 3DIC packaging platforms. 2.Lead the development and qualification of new unit modules and device structures. 3.Establish and validate new process flows in Design Start Modules (DSM) to support custom product platforms. 4.Collaborate directly with customers on product requirements, verification testing, and technical solutions. 5.Apply structured methodologies such as FMEA, DOE, and control plans to optimize performance and mitigate risks.

1.Support new customer product introduction into the FAB, ensuring smooth pilot and tape-out processes. 2.Improve yield and ensure stability in in-line, wafer acceptance test (WAT), and chip probe (CP) results. 3.Define and implement standard operating procedures (SOPs) for production. 4.Collaborate with module engineers to resolve production issues related to yield, reliability, and in-line parameters. 5.Work cross-functionally to develop customized process flows that meet customer need.

1.Monitor in-line process parameters, address abnormalities, and make disposition decisions on lots to ensure smooth production flow. 2.Assist in productivity and yield improvement projects through data analysis and process experiments. 3.Support the establishment and maintenance of key process parameters for semiconductor tools. 4.Evaluate new materials, tools, and methods to enhance manufacturing quality and efficiency.

1.Monitor and resolve in-line SPC (Statistical Process Control) issues, equipment abnormalities, and lot handling in a timely manner. 2.Maintain equipment capability and ensure availability to meet production demand. 3.Collaborate with production and process teams on tool usage for troubleshooting, maintenance, and output. 4.Participate in troubleshooting and quality improvement projects to enhance equipment reliability and production outcomes. 5.Evaluate new equipment, materials, and retrofits to drive performance gains and production efficiency.

1.Conduct TCAD-based research and simulations to explore novel device concepts and architectures. 2.Develop, document and calibrate TCAD simulation decks in collaboration with cross-functional project teams. 3.Execute TCAD design of experiments (DOE) and generate tuning decks to support device optimisation. 4.Design test keys and layout structures for silicon validation, including bench-level electrical measurements and performance analysis. 5.Run structured experiments to fine-tune device parameters while safeguarding long-term reliability.

1.Day to Day monitoring and ownership to timely address in-line defect abnormality escalation, handling and disposition 2.Render support in Production ramp-up, New process implementation and process characterization for project success 3.Evaluate and implement productivity projects for DM Production, Tool and Cost index improvement 4.Define and deploy inspection tool recipes BKM to ensure detection capability 5.Assist in Customer audits on inspection strategy deployment and execution 6.Perform baseline defect improvement

1.New Device Introduction: Perform tape-out/tooling operations for customer design database and achieve the goal of first pilot success. 2.Project coordination: Customer interface and cross department coordination with seamless communications. 3.Manage conference calls, meetings and customer visits with professional presentation skills and logistics arrangement for project success. 4.Project management: Documentation, summary, meeting minutes and ability to recap keynote of meetings for management team review.