清大專區

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=300&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Analyze Biz.(i.e. Finance, Accounting, Procurement, Warehouse, Import/Export, …) users’ requirement. 2. Design, develop, and maintain SAP S/4 HANA, SAP EWM, BI, Group Reporting, and SAP Cloud solution with cross system integration. 3. Build data platform integration for finance and logistics domain. 4. Manage requirement, project schedule, and deliverables. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=550&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: Apply advanced computational models to predict performance, optimize structure and doping profile, and provide improvement directions in nano-scaled device technologies. Develop and apply finite element method (FEM) modelling, including but not limited to stress simulations, computational fluid-dynamics, thermal conductivity simulations and electromagnetic wave simulations, for both macroscopic (tool/wafer) and microscopic (discrete device) structures. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=393&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for flash memory and logic products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=548&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Network management. 2. Firewall management. 3. Security product(e.g., WAF, Firewall, Proxy, SLB, Antivirus) and Linux management. 4. Data center management. 5. Backup system management. 6. Project management and architecture design. 7. Continuously improvement on the each jobs. 8. IT new technology survey and recommendation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5351&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Embark on a career journey with us, where innovation meets impact. We are searching for a dedicated professional to join our elite team, harnessing the world‘s most sophisticated technology to engineer SRAM that impacts the lives of millions globally. Responsibilities: 1. Spearhead A14 SRAM Development: (1) Yield and Device Optimization: Apply your analytical prowess to enhance SRAM/Device performance and ensuring excellent yield. (2) SRAM Cell Design and Testing: Craft cutting-edge SRAM cells and conduct critical process window evaluations to guarantee optimal design resilience. (3) SRAM Characterization and Validation: Utilize advanced simulation tools to characterize and validate SRAM, paving the way for silicon success. 2. Collaborative Excellence: Cross-Functional Teamwork: Engage with a network of experts across various specialties, including Integration, Design, Product, and Reliability, to fortify SRAM cell robustness. 3. Identify issues and build up methodology, propose solutions and evaluation plans. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16306&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Responsible for leading a group of designers to perform R&D works to evaluate PPA of circuit-level novelties and tapeout proof-of-concept chips. 2. Coordinate with multifunctional teams across Device, Circuit, and System in R&D. 3. Collaborate with external university and industry partners on research topics. 4. Convert results of innovative research into patents and publications. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=19476&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Supervise the DTP quality performance to ensure customer-satisfactory design services. 2. Maintain DTP quality certification and automotive certification through quality guidance and audits. 3. Enhance DTP quality procedures from a technical perspective, covering the process from upstream to downstream. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=21826&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Join our R&D Advanced Packaging team and be at the forefront of developing world class packaging solutions that will power the world‘s most advanced electronics, enable AI platform solution foundries, and influence the entire industry ecosystem. Job Responsibilities: 1. Lead the development and integration of novel advanced packaging technologies, processes, and materials. 2. Design, execute, and analyze experiments to optimize packaging performance, reliability, and cost. 3. Collaborate cross-functionally with design, module, and operations teams to ensure seamless integration and manufacturability. 4. Identify and troubleshoot complex technical challenges in packaging integration, driving root cause analysis and solutions. 5. Contribute to the strategic roadmap for advanced packaging, evaluating new technologies and intellectual property. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22583&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電，成為產品工程師，你將有機會參與世界級先進製程技術，與頂尖團隊合作，挑戰技術極限！你將負責協助產品導入量產、提升良率，並確保產品符合客戶的最高標準。在這裡，你將學習到最先進的半導體技術，並為推動科技發展貢獻力量。我們的專業涵蓋非常廣，從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試，能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝〝More than Moore〝〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22587&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Our key responsibilities include: 1. We ensure customers‘ demands are well satisfied in the rapid market, win customer trust, enhance operation efficiency, and reach profit maximization. 2. We drive for business effectiveness to bring the world changing innovation into reality. 3. Our resources, production and demand planning, pricing, and system integration team develop flexible planning and provide quick responsiveness to coordinate needs between factories and customers. We seek individuals who meet the following criteria: 1. Possess experience in Business, Industrial Engineering, Computer Science, Information Systems, Information Science, or Semiconductor Industry. 2. Have skills in logical thinking and communication, learning agility, and business acumen. The following are detailed job descriptions: 1. Account PC Planner (1) Provide delivery schedule and logistic services to key customer. (2) Coordinate the internal planning team including planning team and backend for delivery. (3) Manage logistic service-related projects and Hub. 2. Fab Production Control Planner (1) Production control related systems initiate/ analyze. (2) Production control related data maintenance. (3) Project management. (4) Mask CLIP setting and delivery management. (5) Co-work with EBO/FPC/APC/Fab for mask support plan. 3. Fab Rationalization Engineer (1) Demand to supply rationalization, maximize capacity utilization. (2) Analyze product and new tape out portfolio for fab utilization effectiveness. (3) Provide FR proposals to optimize fab loading and customer‘s requirements. (4) Synergize demand planning and fab rationalization to maximize fab operational effectiveness and demand support. 4. Operation Resources Planning Engineer (1) Capacity planning and management. (2) Productivity improvement. (3) Capital investment evaluation and control. (4) Fab space layout planning. 5. DevOps Engineer (1) Collaborate with Users, Analyst and Architect on business needs and translate requirements into technical needs. (2) Identify and understand the data sources that are relevant for analysis. (3) Become a subject domain expert in company data especially for corporate planning. (4) Consolidate the requirements and use data engineering skills to design a robust DataMart. (5) Participate in design, architecture review and deployment of planning system and data warehouse solutions. (6) Design for automation and monitoring mechanism in a continuous integration environment. (7) Bring new technology with POC to solve existing business challenges. 6. ML/AI Engineer (1) Research and evaluate pioneering ML/DL/LLM methodologies to address business challenges. (2) Collaborate with engineering teams to conduct data exploration and build data pipelines. (3) Analyze and extract valuable information from vast amount of market data. (4) Implement prototypes and present results to stakeholders. 7. Corporate Planning Associate The CPO Associate Program is designed for young talent eager to accelerate their growth and define the future of TSMC. As an Associate, you will rotate through a variety of roles in your first year to gain broad exposure to TSMC’s Corporate Planning Organization (CPO). The rotation may cover several of the following divisions: operations resource planning, production planning, business operations, advanced packaging supply chain solutions, integrated and intelligent planning, and AI4BI. After successfully completing the rotation program, you will be placed in a role that matches your interests while meeting business needs. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22577&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the APTD (Advanced Packaging Technology Development) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, COUPE and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, COUPE and SoIC) processes and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Wet/Etch/Polymer/Bonding/Thinning/Joint/Saw/Trim/Material module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22737&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 說明: 1. 負責營建工地安全稽核與管理工作，執行現場巡檢與問題記錄 2. 統計與分析工地稽核缺失，配合追蹤改善進度 3. 處理工地安全相關突發事件調查，提供必要協助與記錄 4. 監督工地安全規範落實度，提出改善建議 5. 環安衛相關巡檢與稽核業務，負責提交稽核報告 6. 支援環安衛相關訓練活動及緊急應變器材維護管理 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=22860&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description The coordinator will support the planning, logistics, and administrative execution of events, industry activities, and marketing programs. This role is responsible for ensuring seamless operational delivery by coordinating end-to-end event logistics, inventory, and financial administration. Event Operations & Logistics Coordination 1. Coordinate and track event invitation and registration lists 2. Manage hotel rooming blocks and transportation schedules 3. Organize meeting room scheduling, and on-site operational logistics 4. Oversee the shipping, custom clearance, and inventory tracking of event materials and collateral Division Administration and Financial Operations 1. Collect, verify, and process vendor invoices to ensure timely payments and resolve billing discrepancies 2. Maintain organized vendor records, contracts, and event-related documentation Marketing Collateral & Vendor Coordination 1. Oversee the shipping, customer clearance, and inventory tracking of event materials and marketing collateral 2. Support vendors through TSMCs internal systems, including arranging visitor parking and security access 3. Maintain a digital and physical inventory of all marketing assets Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【工作內容】 1. 執行半導體設備及機台拆卸、零組件檢查與分類。 2. 負責設備機構組裝、零件安裝及相關調整作業。 3. 執行設備調機、功能測試及運作確認。 4. 協助分析設備異常原因，進行基本故障排除與改善。 5. 配合工程進度完成設備拆裝、組立及測試作業。 6. 維持作業現場整潔，確保設備拆裝及操作安全。 7. 協助移機及其他設備組裝及現場工程相關協助事項。 【應徵條件】 1. 專科以上學歷，機械、電機、電子、自動控制等相關科系尤佳。 2. 具機械設備組裝、機台維修、調機或自動化設備相關經驗者尤佳。 3. 熟悉基本機械工具操作，具設備拆裝及問題排除能力。 4. 具責任感，能依工程進度執行工作，並配合團隊合作。 【聘僱期間】 一年期定期契約，實際期間依雙方契約約定。

1.協助 IC 產品檢驗及測試作業。 2.自動化測試設備操作及簡易故障排除。 3.協助生產測試線作業及進出貨安排。 3.負責人員調度、工作分配及現場管理。

1.負責產線設備運作監控，確保生產穩定。 2.處理設備異常與停線問題，執行故障排除及改善。 3.執行設備日常點檢、保養及換線作業。 4.追蹤產品良率與品質，分析異常並提出改善對策。 5.協調跨部門資源，確保客戶端生產進度與目標達成。 6.彙整設備異常紀錄及改善報告。

此角色需與多單位協作支援整體運作，適合能在制度與流程中溝通協調、為系統穩定提供支持的人。 負責廠區 IT 基礎設施日常維運 1. Server 端維運：Windows Server、Hyper-V、Patch 更新、資安防護、備份、資源監控、電腦機房管理等。 2. Client 端管理：Patch 更新、防毒、DHCP、Printer 服務、駐廠服務及軟硬體資產管理等。 3. 配合 ISO27001／ISO22301 等國際認證之合規作業、資安控制措施執行。

【歡迎喜歡與人互動，具備親切應對與溝通能力的你加入我們，一起為孩子創造改變】 【主要工作內容】 1.管理招生諮詢窗口，掌握報名、入班、預約排課等作業流程順暢、資訊正確。 2.建立並優化家長服務流程，處理家長諮詢、需求與意見回饋 3.統籌行政人員早晚班排班、出勤管理與工作分配 4.監督並提升團隊服務品質，培訓與輔導行政同仁 5.追蹤服務費用收款情形及應收帳款 6.彙整營運報表，掌握營運狀況並提出改善方向 7.建立並維護請假、退費、申訴處理、個人資料保護等標準作業流程 8.規劃服務突發狀況之應變SOP，並定期檢視修訂 9.協調教保、治療、社工及行政部門間之跨單位事項 【加分條件】 具護理師執照

上班地點：三和國中捷運附近（走路４分鐘） ### 依據相關經驗與認證起薪 ### ================================ ### 資訊相關科系 ### ### 非資訊科系者【如有3個月或 400 小時以上 相關培訓課程者】 ================================ 擔任客戶現 PC / 用戶端 : 場駐點工程師: 【1】負責企業內部電腦、網路、主機、週邊設備之日常維護與故障排除。 【2】提供使用者技術支援、軟硬體安裝、帳號權限管理及基礎教育訓練。 【3】負責資訊設備盤點、耗材管理、系統備份確認與文件紀錄。 【4】配合客戶現場規範，維持系統穩定運作，確保服務品質。 【5】協助專案執行、系統測試、搬遷與廠商溝通協調。 簽約保障 1 年，工作超穩定 固定地點駐點，不用到處跑 勞健保、年終、三節獎金 公司後勤支援充足，工作有依靠、有發展 特休、國定假日、各項員工福利 表現優異者優先調薪、轉正、晉升透明 ============================ 需約定工作年限! 不適合 只想來練功 累積經驗