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  • 11/21
  • Intelligent Scheduling Engineer (IMC)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5308&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Intelligent Scheduling Development Department (ISDD) in TSMC‘s Intelligent Manufacturing Center (IMC) is responsible for the dispatch and scheduling of various TSMC fabs. It considers multiple constraints such as processes, machines, products, and waiting times, and employs three main methods: 1. Automated rules (Rule based) 2. Optimization through mathematical planning models (Model) 3. Optimization with metaheuristic algorithms (Metaheuristic) The system determines the sequence of products that machines will produce in the future. Colleagues continuously refine the computational engine to improve solving performance and scheduling quality. They also utilize self-developed scheduling systems to help fabs adapt to various scenarios to achieve fab goals and tasks. Moreover, they constantly enhance fab production efficiency and increase wafer output by identifying and capitalizing on opportunities for improvement. Responsibilities: 1. Develop and maintain Scheduling / Dispatching and Manufacturing Report System. 2. Communicate with users to define requirements, design, implement, and deploy systems, and continuously improve them using software engineering methodology. 3. Design system architecture of cross department projects. 4. Lead system design review. 5. Survey and introduce new IT solutions. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • Intelligent Process Control System Engineer (IMC)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5309&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Intelligent Process Control Systems Department (IPCS) in TSMC‘s Intelligent Manufacturing Center (IMC) assists fabs in analyzing process issues. By employing techniques such as experimental design, statistical analysis, optimization algorithms, and machine learning, the department establishes R2R (Run-to-Run) process control models. Subsequently, in collaboration with the system development team, an automated control platform is established and rolled out across various fab zones. This integration aims to enhance staff efficiency and improve overall product quality. Responsibilities: 1. By employing methods such as control system development, algorithm design, and control performance diagnostics, we provide advanced control systems for the semiconductor industry. 2. We use machine learning and optimization algorithms to build models that deliver solutions meeting the needs of the fab zones. 3. We establish automated platforms that utilize techniques such as machine learning and AI for automatic parameter optimization, which reduces staff workload and enhances quality. 4. In collaboration with the system development team, we systematically implement and roll out innovative methods or improvements across various fab zones to boost staff efficiency and product quality. Work Location: Hsinchu/Taichung/Tainan Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • A14 R&D SRAM Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5351&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Embark on a career journey with us, where innovation meets impact. We are searching for a dedicated professional to join our elite team, harnessing the world‘s most sophisticated technology to engineer SRAM that impacts the lives of millions globally. Responsibilities: 1. Spearhead A14 SRAM Development: (1) Yield and Device Optimization: Apply your analytical prowess to enhance SRAM/Device performance and ensuring excellent yield. (2) SRAM Cell Design and Testing: Craft cutting-edge SRAM cells and conduct critical process window evaluations to guarantee optimal design resilience. (3) SRAM Characterization and Validation: Utilize advanced simulation tools to characterize and validate SRAM, paving the way for silicon success. 2. Collaborative Excellence: Cross-Functional Teamwork: Engage with a network of experts across various specialties, including Integration, Design, Product, and Reliability, to fortify SRAM cell robustness. 3. Identify issues and build up methodology, propose solutions and evaluation plans. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • A14 R&D Integration Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Aspire to be a part of a visionary team that develops world-class, cutting-edge technology for the A14 platform? This is a call to those who wish to delve into the realm of interconnect and chip/package (2D/3D) co-optimization, where your work will be integral to our success. Responsibilities: 1. Championing Technological Excellence: (1) Optimization Wizardry: Ensure the A14 program excels by harmonizing process requirements across performance, yield, reliability, and manufacturability through strategic process integration and baseline maintenance. (2) Design & Validation Expertise: Lead the tape-out process and rigorously test key designs to validate design rules, refine electrical modeling, and elevate yield outcomes. (3) Benchmarks & Characterization: Analyze and characterize the electrical performance relative to the process, establish SPICE modeling benchmarks, and perform selective bench measurements to guarantee precision and quality. 2. Collaborative Innovation: (1) Analytical Problem-Solving: Bring your innovative mindset to team efforts, using data analysis to uncover process issues and co-developing new processes as solutions alongside talented peers. (2) Process Evolution: Play a pivotal role in evolving processes from advanced integration baselines to full-scale volume production, ensuring a smooth transition and exemplary results. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • A14 R&D Device Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5354&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We invite you to become an integral part of our forward-thinking team, where you will be at the vanguard of nanosheet transistor device design for our prestigious A14 technology initiative. This role offers a unique opportunity to work on the frontier of semiconductor innovation, collaborating with industry leaders and contributing to technologies that define the next generation of electronics. Responsibilities: 1. Pioneering Nanotechnology Development: (1) Seamless Integration: Integrate devices across various process modules, including the creation of test keys, execution of tape-outs, meticulous device analysis, advanced simulations, and fortification of model integrity. (2) Innovative Design: Craft precision test key designs to facilitate accurate electrical modeling and comprehensive device characterization. (3) Advanced Characterization: Define the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting occasional bench measurements. (4) Experimentation: Design experiments to meet device KPIs for performance and periodically serve as the on-duty engineer to coordinate device process management. 2. Diagnostic Analysis: Critical Data Assessment: Apply your analytical expertise to dissect transistor electrical and physical data, pinpointing issues and identifying responsible parties for targeted resolution. 3. Collaborative Problem-Solving: Interdisciplinary Teamwork: Join forces with a spectrum of specialized teams to scrutinize and appraise new processes, driving the resolution of complex challenges through collective insight and expertise. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • IT DevOps Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5419&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. TSMC IT is actively seeking Software & DevOps Engineers to build and scale next-generation intelligent manufacturing platforms and products (e.g., Intelligent Manufacturing, Engineering Control, Tool Automation, and AI-based BOTs, etc.). In addition to software development, your duties involve interacting with various engineering teams and working closely with operations and infrastructure teams. This is a lifetime career opportunity to invent the future and propel TSMC to the next level. Responsibilities: 1. Cloud-native micro-service architecture design and implementation. 2. Refactor existing monolithic applications to cloud-native architecture. 3. Work with SRE to decide SLI (Service Level Indicator)/SLO (Service Level Objective) and monitor these SLIs. 4. Design the service monitoring and alerting system to monitor and resolve production service issues. 5. Constantly improve automation on service maintenance and operations. 6. Task management and product release management. 7. Drive a culture of high-quality software development and deployment processes. 8. Lead new IT technology evaluation and adoption. The complete interview process includes: 1. Manager interview. 2. Hackerrank test. 3. On-site personality and English test(which could be replaced if you have a script of an officially recognized English test. 4. HR interview. 5. Second manager interview. (Optional assessment) 6. Technical review. (Optional assessment) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • IT Site Reliability Engineer (SRE)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 3年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5448&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are looking for a highly motivated and critical-thinking site reliability engineer to join tsmc. The ideal candidate should have exposure to systems in both staging and production and all technical teams. This position requires software development, support, IT operations, and on-call duties experience. Responsibilities: 1. Develop state-of-the-art applications 2. Continue to refactor existing applications 3. Transform repeatable tasks into automation tools 4. Contribute to writing tests to ensure software quality 5. Apply software design principles to ensure software quality 6. Ensure sustainability and performance of applications 7. Collaborate with peers in design and code reviews. 8. Willing to learn new IT technologies The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test (which could be replaced if you have a script of officially English test 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment). Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • Technical Manager for Numerical Analysis/Methodology Development
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 10年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=7197&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development. 2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • IT AI/ML Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=462&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As an AI/ML Engineer, you will be a key member of a versatile team focusing on both algorithm development and platform implementation for TSMC’s R&D, Fab, Business, IT, and Security functions to improve productivity and work quality. The role involves developing AI/ML solutions, implementing scalable platforms to support AI productionization, and maintaining the lifecycle of machine learning models. Responsibility: Common Responsibilities 1. Collaborate with cross-functional teams of data scientists, ML engineers, and software developers. 2. Drive the complete AI solution development stages from data collection, exploration, and feature engineering to model evaluation and error analysis. 3. Perform model lifecycle management to ensure the validity of models in production. 4. Exercise sound judgment in determining if business problems can be addressed through AI/ML and communicate results effectively to domain users. 5. Operate and maintain scalable, highly available AI platforms with continuous measurement and quality improvement to meet SLO/SLAs. Differentiated Responsibilities 1. AI/ML Solution Development (1) Develop AI/ML algorithms that optimize manufacturing processes, improving productivity and work quality. (2) Explain AI/ML models to internal customers and conduct error analysis. 2. AI Platform Development (1) Design and implement full tech stack solutions, including data-related technologies and AI platforms. (2) Develop tools, automation, and microservices to extend platform capabilities. (3) Manage container-based workloads and process high volumes of data in environments like Kubernetes. Additional information for the job: Job Location: Hsinchu Site, Taipei Office (Experienced only) On-call needs: On-call 1 week every 3 months The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test(which could be replaced if you have script of officially English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • IT Front-End Developer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=449&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Role: TSMC IT is looking for a Front-End Web Developer with experience in front-end and client development to take our products to the next level. Your primary responsibilities might be: (1) Build reusable UI components and code libraries for large-scale use (2) Ensure the technical feasibility of UI/UX designs (3) Optimize application for maximum speed and scalability. You’ll be part of a highly collaborative cross-functional Agile squad consisting of Front-end and back-end engineers, UIUX Designers, and Product Managers. Responsibility: 1.Create a unified component library for use across all products 2.Work closely with senior engineers, UX designers, and product managers to develop friendly UI experiences. 3.Work closely with backend engineers to architect and develop the best technical design. 4.Continuously improve the page responsive speed and guarantee the program‘s compatibility and efficiency. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • AMHS Installation Assistant Engineer 自動化設備裝機助理工程師
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,月薪 39,000~0元0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=13732&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Assistant Engineer for Automated Material Handling System (AMHS) Installation. 2. Responsible for the installation of automated equipment, assembly of power systems, equipment tuning, testing, and trouble shooting. Monthly Salary Range: from $39,000 1. 自動物料搬運系統 (AMHS) 裝機助理工程師. 2. 負責自動化設備安裝,電力系統裝配,設備調機,測機,與緊急搶修. 薪資範圍: 39,000以上 Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • R&D IIP 3DIC Metrology Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 2年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Responsibilities: Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency. 1. Develop and maintain baselines, including setting up recipes. (1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications. (2) Responsible for transferring metrology solutions to volume manufacturing. 2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel. (1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency. (2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • Advanced Packaging Technical Manager
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 5年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15646&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Be responsible for establishing a R&D line, including tool evaluation and process development. 2. Enhance tooling capabilities to meet the demands of advanced packaging products. 3. Establish a standardized methodology for process development and characterization of panel manufacturing processes. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • R&D IIP Panel Process Engineer
  • 苗栗縣竹南鎮
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16023&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Responsibilities: 1. Advanced panel level packaging development for CoPoS technology. 2. Exploratory panel level packaging process/material/tool development for new applications. 3. Process stability/manufacturability improvement for yield and reliability qualification. 4. Responsible for transferring the process/material/tool for mass production. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • Circuit Design Manager (Corporate Research)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 5年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16306&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Responsible for leading a group of designers to perform R&D works to evaluate PPA of circuit-level novelties and tapeout proof-of-concept chips. 2. Coordinate with multifunctional teams across Device, Circuit, and System in R&D. 3. Collaborate with external university and industry partners on research topics. 4. Convert results of innovative research into patents and publications. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • Memory Design Manager
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 8年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16346&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are looking for a technical manager who is excited to join a growing group of diverse talents responsible for driving novel memory solutions for the leading-edge AI and HPC chips. You will be part of a memory solution team developing high-density memory macro, complex analog, and chip interface circuits for advanced memory technology. We have crafted a team of outstanding engineers stretching around the globe. If you have the dream to develop new technologies and have the real impact on the future of AI compute, this is the ideal position for you. Responsibilities: 1. Lead the designs of memory architecture, memory, analog and digital circuits, and test chip, ensuring they meet the performance, power, and area specifications. 2. Provide technical leadership in areas like memory read/write circuits, analog biasing circuits including LDO and charge pump, design-for-test (DFT), function verification, and memory chip integration. 3. Collaborate closely with technologists and customers to define PPA specifications, architecture, and design of memory circuits. 4. Demonstrate hands-on expertise in designing memory circuit blocks and utilizing EDA tools for timing, power, signal integrity, EM/IR analysis, static timing, and noise analysis. 5. Drive design verification and implement quality assurance methodologies for memory IP. 6. Define silicon test plans and provide support for post-silicon bring-up and debugging in collaboration with test teams. 7. Manage design projects by planning and organizing design resources, while addressing customer/client requests and events as they arise. 8. Work closely with cross-functional teams across global locations to ensure successful project execution. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • IT Platform Engineer
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 5年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16482&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As a platform engineer, you will focus on designing, implementing, and maintaining scalable features and services on the platform to support the productionization of applications that support the company’s R&D/Fab/Business/IT/Security functions to improve the productivity and work quality. Job Responsibilities: Your responsibilities include: 1. Automation and Scripting (1) Develop and maintain automation scripts for configuration, monitoring, and management using tools such as Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. (3) Implement Infrastructure as Code (IaC) to automate resource provisioning and CI/CD workflows. 2. Application Development (1) Develop scalable cloud-native microservice architectures for IT applications. (2) Develop state-of-the-art applications and refactor existing ones to improve performance and maintainability. (3) Apply software design principles, such as 12-factor app, to ensure sustainability and quality. (4) Write and implement tests (unit/feature/integration) to guarantee software integrity. 3. Monitoring and Troubleshooting (1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Conduct root cause analyses and apply corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Lead evaluation and adoption of new IT technologies for continuous improvement. 4. (Optional) Network Design and Management (1) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy. (2) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only) On-call needs: On-call 1 week every 3 months The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test (which could be replaced if you have script of an official English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • IT Infrastructure Engineer
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=555&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking outstanding engineers to join TSMC IT infrastructure team to build and operate IT advanced Data Center to support world-class semiconductor foundry. This team is responsible for designing, implementing and optimizing IT infrastructure towards software-defined computing, storage and networking with advanced cloud technologies. The successful candidate should have strong technical skills and dedication for operation excellence. Job Responsibilities: Your responsibilities include: 1. Network/Storage Design and Management: (1) Design, construction, operation, and capacity planning of large-scale NAS storage/object storage. (2) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy. (3) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. 2. Automation and Scripting: (1) Develop and maintain automation scripts for network configuration, monitoring, and management using tools like Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. 3. Application Development: (1) Develop state-of-the-art applications and refactor existing applications for improved performance and maintainability. (2) Write and implement tests (unit/feature/integration) to guarantee software integrity. 4. Monitoring and Troubleshooting: (1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Perform root cause analysis and corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Infrastructure operation issues(network/server/storage/security) visualization and countermeasure planning. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only) On-call needs: On-call 1 week every 3 months 1. Manager interview 2. Hackerrank test 3. On-site personality and English test(which could be replaced if you have script of an official English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • AMHS Installation Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16660&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Automatic Material Handling System (AMHS) Engineer, Normal Shift. 2. Responsible for the installation of automated equipment, assembly of power systems, equipment tuning, testing, and trouble shooting. 3. Install the most advanced material handling and transportation system worldwide at a new site from day one. 4. A highly motivated individual with a strong technical background and capability to planning and sustain AMHS devices. 5. Working with a team which may include MFG, module, facility, quality team to achieve productivity, efficiency, quality excellence. 6. Lead and drive external supplier in Taiwan, Japan, Europe, America area to develop new devices and delivery on time. 7. Analysis and optimize AMHS transportation bottleneck. 8. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 11/21
  • 安全衛生工程師 - 一年期合約人員
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 2年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16693&source=1111 台積公司成立於1987年,率先開創了專業積體電路製造服務之商業模式,自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展,以此釋放全球半導體產業的創新。身為全球的企業公民,台積公司的營運範圍遍及亞洲、歐洲及北美,致力成為企業社會責任的行動者。2024年,台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術,為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 說明: 1. 營建工地安全稽核與管理工作 2. 制定並執行安全檢查計劃 3. 工地稽核缺失之統計分析與追蹤 4. 協助處理工地安全相關的突發事件調查 5. 監督工地安全規範的落實 6. 安全教育訓練及宣導 7. 安全與衛生改善專案,如:承攬商管理、施工現場安全、暴露評估、安全衛生培訓、人因工程評估、緊急應變等 營造一個合乎台積公司核心價值與經營理念的全球共融職場,對於公司未來成功至關重要。台積公司對全球共融職場的承諾,旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向,都能將其自身的觀點與經驗帶入工作,促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融,讓每一位員工都覺得被重視且有能力為企業使命提供貢獻,並為全球各戶提供卓越服務。