清大專區

｜工作內容｜ 1、根據產品需求及業務邏輯量身打造測試計畫，撰寫測試案例，對產品功能執行測試。 2、持續追蹤問題進度，有效管理處理情況，產出測試報告及使用建議。 3、熟悉功能測試、軟體整合測試、測試環境建置規劃。 4、APP遊戲版本的各項功能與規格驗證。 5、良好的團隊合作意識、抗壓性和溝通能力。 ｜具備能力｜ ※ 外語能力：英文需能 讀、寫 程度。 ※ 一年以上測試相關經驗。 ※ 熟悉測試理論和方法，瞭解相關的測試流程、測試文檔標準、測試工具和框架。 ｜必備條件｜ ● 相關經驗 1 年 以上 ● 具溝通協調能力 ● 對遊戲產業充滿熱情；參與過多個遊戲專案開發與測試 ● 工作積極主動、熱情、細心並且有耐心，善於發現和解決問題 ● 重視自律及團隊合作的精神 ● 自主性高，能主動向上及橫向同步工作事項 ｜加分項目｜ ● 對App抓包軟體有基本認識及運用

1、RMA客退產品功能異常分析、電路分析，並熟練操作烙鐵等工具，進行軟硬體故障排除。 2、客戶問題諮詢、維修進度追蹤與報價，具備良好的客訴應對與溝通能力。 3、操作ERP系統進行資料登錄，並負責維修零件或客退產品的倉庫管理（如進出庫、盤點）。 4、執行日常文書檔案處理，並協助主管交辦的各項行政或專案事項。

1.負責 PCBA 電路異常查修，運用示波器、三用電表等儀器進行訊號量測，精準定位失效點並排除問題。 2.針對電子元件與電路失效進行根因分析（Root Cause Analysis），深入研究工程技術問題，並提出具體的改善與預防對策。 3.負責編製專業的異常分析報告（8D Report / NCR），完整記錄異常現象、分析過程、實驗數據及長遠改善方案。 4.具備電路板（PCBA）DIP/SMD 零件手動焊接、修改線路（跳線）及打樣測試之實作能力，以支援工程驗證。 ★【無相關經驗者可培訓】 ★【優質福利】 附有員工餐廳，上班時段免費供餐 免費汽、機車停車位(平鎮廠區) 生日全薪假及專屬電子禮券 尾牙與高額獎項摸彩

1. 執行成品檢驗之工作。 2. 製程及成品品質檢驗、統計、分析、改善、反應與追蹤。 3. 填寫成品檢驗紀錄。 4. 成品品質異常開立不合格品驗退通知單.不良品拍照存檔。 5. 接受上級交辦事項。

1、負責打樣中心所有來料（IQC）與出貨（FQC/OBA）檢驗 2、支援台灣區域的生產異常初步分析與樣品品質驗證測試。 3、追蹤異常件的閉環（8D Report 執行確認與改善追蹤）。

【伺服器系統工程師 Sustaining System Engineer (專案管理與量產維護)】 1.維護及建立量產後的伺服器產品物料清單（BOM），確保資料正確性、完整性並即時更新。 2.管理量產後的伺服器產品相關文件，包含組裝文件（Assembly Guideline）、機櫃走線圖（Cable Routing）、標籤規格（Label Specifications），確保工廠生產文件一致。 3.跨部門協調量產問題改善，協助分析並追蹤產品於量產階段的系統異常與品質議題，與PM、研發設計、製造單位共同推動問題解決。 4.發起工程變更需求並執行，優化伺服器產品設計及替代料導入，提升產品品質、供料彈性與生產效率。 ***************************************************** 1.Manage and maintain Bill of Materials (BOM) for mass production Server products, ensuring data accuracy, completeness, and timely updates. 2.Maintain engineering documentation for mass production Server products, including Assembly Guidelines, Cable Routing and Label Specifications. 3.Drive cross-functional resolution of production, system, and quality issues by working closely with PM, NPI teams and Manufacturing sites. 4.Initiate the Engineering Change Requests (ECR) to optimize server design and manage second source qualification. • 計畫介紹： • 實習期間: 即日起-2027/6 (長期實習) • 職缺內容: 實習生 (在學學生) • 實習薪資: 時薪(一週3天以上)，優於基本工資

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22811&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們是半導體晶片誕生的魔術師！光罩是晶圓製造的關鍵，更是台積電在先進製程中拉升良率的核心。作為我們的一員，您將致力於提升良率並開發次世代的光罩技術。 如果您對挑戰科技極限充滿熱忱，並渴望為最前沿的半導體進展做出貢獻，歡迎加入我們，共同定義科技的未來！ 1. Implement next-generation process transfer, optimize process recipes, evaluate advanced e-beam tools, and apply image processing to troubleshoot line anomalies and drive yield improvements. 2. Participate in advanced technology OPC development, build optical models for simulation, analyze distributed computing big data, and integrate generative AI for defect gating and pattern conversion. 3. Optimize daily production indices, develop factory automation systems to enhance manufacturing efficiency, utilize data analysis to improve workflows and achieve production goals. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1.曾負責 DDIC（Display Driver IC）及 Gold Bump Wafer 之 CP 測試者優先 2.負責 CP 測試程式、測試條件及測試流程之建立與最佳化，包含新產品導入、工程批驗證及量產條件建立。 3.負責測試相關 SOP、Control Plan、PFMEA、OCAP及相關工程文件建立與維護。 4.視專案需求參與新 Tester、Prober、Probe Card及測試平台之評估、導入與 Qualification。 5.具有設備選型、新產線建置或 Technology Transfer經驗。 6.具英文技術文件閱讀、撰寫及溝通能力。 Responsibilities 1.Candidates with hands-on CP testing experience for DDIC (Display Driver IC) and Gold Bump wafers are highly preferred. 2.Responsible for the development and optimization of CP test programs, test conditions, and test flows, including New Product Introduction (NPI), engineering lot validation, and mass production test setup. 3.Develop and maintain test-related SOPs, Control Plans, PFMEAs, OCAPs, and other related engineering documentation. 4.Participate in the evaluation, selection, qualification, and implementation of new testers, wafer probers, probe cards, and test platforms according to project requirements. 5.Experience in equipment selection, new production line setup, or technology transfer is preferred. 6.Proficiency in reading and writing technical documents in English, with effective English communication skills.

1.負責新產品及新客戶 NPI（New Product Introduction），包含製程條件建立、DOE、工程批驗證、量產移轉及製程文件建立。 2.協助建立及維護 SOP、Control Plan、PFMEA、OCAP、製程規格及相關工程文件。 3.視專案需求參與新設備、新材料、新化學品及新製程之評估與導入。 4.具有 Gold Bump 新產線建置、technology transfer或產能擴充經驗。 5.具備英文技術文件閱讀、撰寫及溝通能力 Responsibilities 1.Lead New Product Introduction (NPI) for new products and customers, including process condition setup, DOE execution, engineering lot validation, mass production transfer, and process documentation. 2.Support the development and maintenance of SOPs, Control Plans, PFMEAs, OCAPs, process specifications, and other related engineering documentation. 3.Participate in the evaluation, qualification, and implementation of new equipment, materials, chemicals, and processes as required by projects. 4.Experience in Gold Bump production line setup, technology transfer, or capacity expansion. 5.Proficiency in reading and writing technical documents in English, with effective English communication skills.

1、負責 ISO 9001、ISO 14001 管理系統之推動、維護與持續改善 2、管理系統文件撰寫、修訂、審查與維護 3、內部稽核執行 4、外部稽核與認證應對 5、品質數據分析與改善 6、主管交辦事項

1.圖面設計/製作 2.現場管路設計 3.空間管理與協調 4.電腦操作：MS-office、熟AutoCAD 2D及Revit

我們正在成立一個全新的專案團隊！ 你不會只負責單一專案，而是有機會參與 AI 工具導入、系統平台測試、營運流程優化、數據整理及不同類型的公司專案。 我們不要求你一開始什麼都會，但希望你願意學、喜歡研究工具，也能把事情持續往前推。 【你會做什麼】 ・協助多項專案執行、進度追蹤及資料整理 ・整理 Excel 報表及專案數據，協助發現問題與異常 ・使用 ChatGPT、Claude、Gemini 等 AI 工具提升工作效率 ・參與新系統、平台及 AI 工具測試，整理問題與改善建議 ・協助流程、表單及工作方式優化 ・參與專案會議及跨部門溝通協作 【我們希望你】 ・熟悉 Excel、Word、PowerPoint，Office 操作能力中上 ・對數字有敏感度，不排斥整理及分析資料 ・有使用 AI 工具的習慣，並願意持續學習新工具 ・具邏輯及整理能力，能掌握多項工作的優先順序 ・遇到不熟悉的事情，願意主動查資料、研究及嘗試 【有這些經驗更加分】 ・專案助理、專案執行或專案團隊經驗 ・熟悉 Excel 函數、樞紐分析及報表整理 ・曾使用 AI 工具改善工作流程或提升效率 ・系統測試、平台導入、流程優化相關經驗 【薪資與工作條件】 ・月薪 32,000～38,000 元，依相關經驗及能力核薪 ・工作時間：09:00～18:00 ・週休二日，國定假日休假 ・工作地點：新北市三重區（捷運先嗇宮站步行5分鐘) 沒有專案實務經驗也歡迎應徵！ 如果你曾經因為一件工作太麻煩，自己研究 Excel、AI 或其他工具，想辦法讓事情變簡單、變快，我們很想認識你。 如果你喜歡學新東西、研究新工具，也想累積 AI 應用與跨領域專案實戰經驗，歡迎加入我們！

1. 行政事務文書作業、報表製作 2. ISO系統管理作業 3. 日常事務執行及部門支援 4. 請購、申請物料 5. 標籤機圖檔設計、操作列印 6. 主管交辦事項

【關於我們】 我們是 Energizer 行動電源與周邊商品的全球國際電子品牌授權商，專注於將國際知名品牌的高品質產品推廣至全球市場。 從 行動電源、無線充電器到各式 3C 周邊設備，我們的產品已遍佈全球 60 多個國家。 此職位為品牌國外市場業務，是公司連結國際市場的關鍵橋樑。 公司因應全球市場開發需求，工作內容說明如下 【工作內容】 1. 客戶開發與業績達成 2. 報價、訂單與合約管理 3. 跨部門協調 4. 應收帳款管理 5. 品質異常管理 【我們希望您是這樣的夥伴】 1.具消費性電子品牌產業之業務二年以上經驗尤佳 2.熟悉東南亞，紐澳，美洲市場開發經驗者尤佳 3.精通英文 歡迎您的加入~

【關於我們】 我們是 Energizer 行動電源與周邊商品的全球國際電子品牌授權商，專注於將國際知名品牌的高品質產品推廣至全球市場。 從 行動電源、無線充電器到各式 3C 周邊設備，我們的產品已遍佈全球 60 多個國家。 此職位為海外業務的後勤支援窗口，負責跨國客戶之英文溝通及訂單流程管理。 【工作內容】 1. 英文跨國溝通 • 與國外客戶英文往來 Email • 回覆詢價、文件需求、交期更新、出貨狀態 2. 訂單處理 • 處理 PO / PI / SO • 回覆客戶訂單狀況 • 整合生產、倉庫、報關、物流資訊 • 開立 Invoice、Packing List、Shipping Advice • 協助追蹤客戶付款、出貨、樣品 3. 報價與產品資料準備 • 製作英文報價（Quotation / Price Sheet） • 提供產品規格、照片、認證等資料 (本職務為支援服務國外之業務代表) 【我們希望您是這樣的夥伴】 1.具國外業務貨業助相關工作經驗 2.具責任感、溝通協調能力 3.良好的英文商用書信應用能力

1. 至科技廠、工廠及企業客戶現場執行設備安裝與建置作業。 2. 網路線佈設、設備接線及施工整理。 3. 設定設備網路參數（IP、Gateway、DNS等）。 4. 執行設備功能測試。 5. 處理現場設備異常及基本故障排除。 6. 填寫施工紀錄、驗收文件及服務報告。 7. 配合專案需求至外縣市或客戶廠區出差施工。

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22576&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel process/device/product developing for Specialty technologies. 2. Process Integration/Module, Device Analysis/Simulation, Modeling, Test-chip design tape out and WAT/Bench measurement system developing. 3. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22578&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, troubleshooting equipment and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.