清大專區

【為什麼要加入台灣大哥大 IT 攻城精英團隊】 1.我們有穩定的福利制度，也有新創公司般的工作挑戰 2.我們致力打造一起學習、正向鼓勵回饋的工作環境 3.我們有體貼的居家上班制度 4.我們不是傳統的電信公司!正加速往區域級科技電信集團目標大步邁進 5.我們能讓你從「攻城師」升級為「攻城精英」，這裡絕對是個讓你可以升級武器、切磋技能、激發潛能的難得機會 6.我們還有一位跨領域身經百戰、兼具感性與知性、熱愛分享的超強 CIO 隊長！ 【我們喜歡什麼樣的人】 1.具備團隊合作精神的 team player 2.優異的溝通及表達能力 3.開創性思考的能力 4.極端正面的工作態度、積極進取 5.具備優異的技術專案規劃、統籌與實作能力 6.對新興技術展現優異的理解能力及應用思維 工作不是人生的全部，但是一份精彩的工作會豐富成就你更好的人生 請給自己也給我們一個機會，加入我們一同持續精進IT專業技術，改寫自己的人生與改寫世界，讓我們一起變得更好，歡迎登艦！ 【工作內容】 1.系統需求架構規劃、設計、開發。負責前後端技術整合，協助開發 Web API 與 RESTful API 服務。進行 SQL 資料庫查詢、效能調優與資料建模，優化數據存取效率。 2.善用 AI coding tools 加速開發並提升品質的經驗。 【必備技能】 1.熟悉 Java 程式開發與SQL程式後端開發技能 2.熟悉 JavaScript、HTML5、CSS 前端開發 3.具備系統分析/設計(SA/SD)經驗 【加分條件】 1.熟悉 Spring、Springboot 等框架 2.具備前端應用技術者佳 (如Angular/React/Vue.js) 3.熟悉 Python / Shell Script 程式開發 4.具備 Redis 整合應用經驗尤佳 5.具備 PostgreSQL經驗尤佳 6.具備 Docker及 CI/CD 經驗尤佳 7.具備 AWS、Azure、GCP 等任一雲使用/開發/佈署經驗佳 8.具備帶領開發小組經驗尤佳 9.具備英文聽/說/讀/寫基本能力，有多益(TOEIC)聽讀550分以上尤佳 【薪資待遇】面議，依績效另有豐厚年終獎金與員工紅利

【為什麼要加入台灣大哥大 IT 攻城精英團隊】 1.我們有穩定的福利制度，也有新創公司般的工作挑戰 2.我們致力打造一起學習、正向鼓勵回饋的工作環境 3.我們有體貼的居家上班制度 4.我們不是傳統的電信公司!正加速往區域級科技電信集團目標大步邁進 5.我們能讓你從「攻城師」升級為「攻城精英」，這裡絕對是個讓你可以升級武器、切磋技能、激發潛能的難得機會 6.我們還有一位跨領域身經百戰、兼具感性與知性、熱愛分享的超強 CIO 隊長！ 【我們喜歡什麼樣的人】 1.具備團隊合作精神的 team player 2.優異的溝通及表達能力 3.開創性思考的能力 4.極端正面的工作態度、積極進取 5.具備優異的技術專案規劃、統籌與實作能力 6.對新興技術展現優異的理解能力及應用思維 工作不是人生的全部，但是一份精彩的工作會豐富成就你更好的人生 請給自己也給我們一個機會，加入我們一同持續精進IT專業技術，改寫自己的人生與改寫世界，讓我們一起變得更好，歡迎登艦！ 【工作內容】 將參與以下專案的開發與維運 1. AI 代理與生成式應用專案 2. EIM 企業通訊軟體 【必備技能】 1. 熟悉Python程式語言 2. 熟悉Flask/FastAPI框架使用 3. 熟悉GCP/AWS任一雲端服務 4. 熟悉Git版本控制相關操作 5. 熟悉物件導向程式設計之觀念 6. 需有完整參與專案的經驗 7. 對於以下技術有使用經驗 (任何一種關聯式資料庫，Redis，Linux) 8. 具備容器化相關知識 9. 良好的溝通能力並與合作團隊協作 【加分條件】 1. 具備英文聽/說/讀/寫基本能力，有多益(TOEIC)聽讀550分以上尤佳 【薪資待遇】面議，依績效另有豐厚年終獎金與員工紅利

【為什麼要加入台灣大哥大 IT 攻城精英團隊】 1.我們有穩定的福利制度，也有新創公司般的工作挑戰 2.我們致力打造一起學習、正向鼓勵回饋的工作環境 3.我們有體貼的居家上班制度 4.我們不是傳統的電信公司!正加速往區域級科技電信集團目標大步邁進 5.我們能讓你從「攻城師」升級為「攻城精英」，這裡絕對是個讓你可以升級武器、切磋技能、激發潛能的難得機會 6.我們還有一位跨領域身經百戰、兼具感性與知性、熱愛分享的超強 CIO 隊長！ 【我們喜歡什麼樣的人】 1.具備團隊合作精神的 team player 2.優異的溝通及表達能力 3.開創性思考的能力 4.極端正面的工作態度、積極進取 5.具備優異的技術專案規劃、統籌與實作能力 6.對新興技術展現優異的理解能力及應用思維 工作不是人生的全部，但是一份精彩的工作會豐富成就你更好的人生 請給自己也給我們一個機會，加入我們一同持續精進IT專業技術，改寫自己的人生與改寫世界，讓我們一起變得更好，歡迎登艦！ 【工作內容】 1. 自動化部署/升級腳本（如 Ansible、PowerShell、Bash） 2. 分析與優化系統效能監控機制（使用 Grafana、Prometheus 等） 3. 協助推動內部作業流程標準化與資料儀表板建構 4. 協助維運與優化虛擬化平台資源配置與負載調度策略 【必備技能】 1.熟悉 Log 監控、事件管理及威脅調查技術 2.了解網路安全架構、惡意行為分析與資安威脅評估流程。 3.熟悉 Linux / Windows 系統操作與網路基本架構。 4.具備 Python、Bash 或其他腳本語言基礎能力，以提升資安作業自動化程度。 5.良好的溝通與跨部門協作能力，能與資安、IT、管理團隊有效配合。 【加分條件】 具備英文聽/說/讀/寫基本能力，有多益(TOEIC)聽讀550分以上尤佳 【薪資待遇】面議，依績效另有豐厚年終獎金與員工紅利

【為什麼要加入台灣大哥大 IT 攻城精英團隊】 1.我們有穩定的福利制度，也有新創公司般的工作挑戰 2.我們致力打造一起學習、正向鼓勵回饋的工作環境 3.我們有體貼的居家上班制度 4.我們不是傳統的電信公司!正加速往區域級科技電信集團目標大步邁進 5.我們能讓你從「攻城師」升級為「攻城精英」，這裡絕對是個讓你可以升級武器、切磋技能、激發潛能的難得機會 6.我們還有一位跨領域身經百戰、兼具感性與知性、熱愛分享的超強 CIO 隊長！ 【我們喜歡什麼樣的人】 1.具備團隊合作精神的 team player 2.優異的溝通及表達能力 3.開創性思考的能力 4.極端正面的工作態度、積極進取 5.具備優異的技術專案規劃、統籌與實作能力 6.對新興技術展現優異的理解能力及應用思維 工作不是人生的全部，但是一份精彩的工作會豐富成就你更好的人生 請給自己也給我們一個機會，加入我們一同持續精進IT專業技術，改寫自己的人生與改寫世界，讓我們一起變得更好，歡迎登艦！ 【工作內容】 1. 協助建構與優化企業雲端平台 2. 開發基礎設施即程式碼（IaC）自動化部署腳本 3. 協助維運與優化虛擬化平台資源配置與負載調度策略 4. 執行容器化部署與管理技術研究，強化服務彈性與高可用性 【必備技能】 1.熟悉 TCP/IP 協定，理解網路通訊原理 2.熟悉雲端平台（如 AWS、Azure、GCP）架構與設計原則，有實際操作經驗 3.具備獨立解決問題的能力，也能靈活與團隊合作 4.熟悉 Windows 與 Linux 作業系統的日常維運操作 5.對新技術保有高度好奇心與學習熱情，願意持續升級技術武器包 【加分條件】 具備英文聽/說/讀/寫基本能力，有多益(TOEIC)聽讀550分以上尤佳 【薪資待遇】面議，依績效另有豐厚年終獎金與員工紅利

【為什麼要加入台灣大哥大 IT 攻城精英團隊】 1.我們有穩定的福利制度，也有新創公司般的工作挑戰 2.我們致力打造一起學習、正向鼓勵回饋的工作環境 3.我們有體貼的居家上班制度 4.我們不是傳統的電信公司!正加速往區域級科技電信集團目標大步邁進 5.我們能讓你從「攻城師」升級為「攻城精英」，這裡絕對是個讓你可以升級武器、切磋技能、激發潛能的難得機會 6.我們還有一位跨領域身經百戰、兼具感性與知性、熱愛分享的超強 CIO 隊長！ 【我們喜歡什麼樣的人】 1.具備團隊合作精神的 team player 2.優異的溝通及表達能力 3.開創性思考的能力 4.極端正面的工作態度、積極進取 5.具備優異的技術專案規劃、統籌與實作能力 6.對新興技術展現優異的理解能力及應用思維 工作不是人生的全部，但是一份精彩的工作會豐富成就你更好的人生 請給自己也給我們一個機會，加入我們一同持續精進IT專業技術，改寫自己的人生與改寫世界，讓我們一起變得更好，歡迎登艦！ 【工作內容】 參與資料倉儲需求開發、資料分析/應用、大數據應用之專案開發與系統維運。資料工程包括ETL、SQL程式與BI Report，另外ML/DL建模則包括Python 與機器學習框架及套件等。善用 AI coding tools 加速開發並提升品質的經驗。 【必備技能】 資料工程： 1.具備資料倉儲ETL開發技能 2.具備SQL程式後端開發技能 3.具備BI Report開發經驗 【加分條件】 資料工程 1.具備Trinity ETL開發經驗 2.具備Teradata SQL開發經驗 3.具備SQL Server Reporting Service報表開發經驗 4.具備Azure PowerBI報表開發經驗 5.具備SAP BOE開發經驗 6.具備Python後端開發經驗 7.善用 AI coding tools 加速開發並提升品質的經驗 【薪資待遇】面議，依績效另有豐厚年終獎金與員工紅利

【為什麼要加入台灣大哥大 IT 攻城精英團隊】 1.我們有穩定的福利制度，也有新創公司般的工作挑戰 2.我們致力打造一起學習、正向鼓勵回饋的工作環境 3.我們有體貼的居家上班制度 4.我們不是傳統的電信公司!正加速往區域級科技電信集團目標大步邁進 5.我們能讓你從「攻城師」升級為「攻城精英」，這裡絕對是個讓你可以升級武器、切磋技能、激發潛能的難得機會 6.我們還有一位跨領域身經百戰、兼具感性與知性、熱愛分享的超強 CIO 隊長！ 【我們喜歡什麼樣的人】 1.具備團隊合作精神的 team player 2.優異的溝通及表達能力 3.開創性思考的能力 4.極端正面的工作態度、積極進取 5.具備優異的技術專案規劃、統籌與實作能力 6.對新興技術展現優異的理解能力及應用思維 工作不是人生的全部，但是一份精彩的工作會豐富成就你更好的人生 請給自己也給我們一個機會，加入我們一同持續精進IT專業技術，改寫自己的人生與改寫世界，讓我們一起變得更好，歡迎登艦！ 【工作內容】 主要負責設計、開發、測試並維護基於FreeSWITCH的通訊軟體語音即時通訊功能，並進行系統整合與效能優化 【必備技能】 1. 熟悉 C# / ASP.NET / NET Core 程式開發 2. 熟悉 API / Web API 架構設計 3. 熟悉 Entity Framework / Entity Framework Core 4. 熟悉 SQL 資料庫開發與設計 5. 孰悉網頁開發 (HTML5、CSS3、JavaScript) 【加分條件】 1. 有 CI / CD 使用經驗 2. 有 Dcoker 開發管理經驗 3. 有前端框架使用經驗，Angular 尤佳 4. 有 AI 工具使用經驗 【薪資待遇】面議，依績效另有豐厚年終獎金與員工紅利。

1.帶領業務人員績效及行政事務進行 2.行網／固網／SaaS服務等產品上市推廣作業及營運成本控制 3.管理與制定團隊方針與月度／季度／年度目標 4.帶領團隊進行業務推展與跨部門橫向溝通以達成目標 【薪資待遇】月薪面議，依績效另有豐厚年終獎金與員工紅利

主要負責台灣大哥大既有用戶分眾行銷，包含用戶分群分析及專屬行銷專案規劃 1.分群用戶行為分析 2.分眾續約專案規劃與執行 2.分眾溝通規劃與執行 3.分眾續約成效分析與追蹤 【薪資待遇】月薪依能力與經歷核敘；若績效達平均水準者，年薪約81~108萬，績效優者年薪將更高。

為達成myfone網路門市經營目標(商品開發經營及營收/毛利/購買件數等)，負責以下工作: 一、 負責電商平台商品線管理及KPI營運追蹤分析 二、 負責供應商規劃引進、銷售規劃、前後台維運與提升銷售量能及毛利 三、 CRM專案推廣機制規劃/設定 四、 跨部門溝通協調 五、 其他主管交辦事項 【薪資待遇】月薪依能力與經歷核敘；若績效達平均水準者，年薪約81~108萬，績效優者年薪將更高。

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=13732&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Assistant Engineer for Automated Material Handling System (AMHS) Installation. 2. Responsible for the installation of automated equipment, assembly of power systems, equipment tuning, testing, and trouble shooting. Monthly Salary Range: from $39,000 1. 自動物料搬運系統 (AMHS) 裝機助理工程師. 2. 負責自動化設備安裝,電力系統裝配,設備調機,測機,與緊急搶修. 薪資範圍: 39,000以上 Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Responsibilities: Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency. 1. Develop and maintain baselines, including setting up recipes. (1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications. (2) Responsible for transferring metrology solutions to volume manufacturing. 2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel. (1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency. (2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15646&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Be responsible for establishing a R&D line, including tool evaluation and process development. 2. Enhance tooling capabilities to meet the demands of advanced packaging products. 3. Establish a standardized methodology for process development and characterization of panel manufacturing processes. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16023&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Responsibilities: 1. Advanced panel level packaging development for CoPoS technology. 2. Exploratory panel level packaging process/material/tool development for new applications. 3. Process stability/manufacturability improvement for yield and reliability qualification. 4. Responsible for transferring the process/material/tool for mass production. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16306&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Responsible for leading a group of designers to perform R&D works to evaluate PPA of circuit-level novelties and tapeout proof-of-concept chips. 2. Coordinate with multifunctional teams across Device, Circuit, and System in R&D. 3. Collaborate with external university and industry partners on research topics. 4. Convert results of innovative research into patents and publications. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16346&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are looking for a technical manager who is excited to join a growing group of diverse talents responsible for driving novel memory solutions for the leading-edge AI and HPC chips. You will be part of a memory solution team developing high-density memory macro, complex analog, and chip interface circuits for advanced memory technology. We have crafted a team of outstanding engineers stretching around the globe. If you have the dream to develop new technologies and have the real impact on the future of AI compute, this is the ideal position for you. Responsibilities: 1. Lead the designs of memory architecture, memory, analog and digital circuits, and test chip, ensuring they meet the performance, power, and area specifications. 2. Provide technical leadership in areas like memory read/write circuits, analog biasing circuits including LDO and charge pump, design-for-test (DFT), function verification, and memory chip integration. 3. Collaborate closely with technologists and customers to define PPA specifications, architecture, and design of memory circuits. 4. Demonstrate hands-on expertise in designing memory circuit blocks and utilizing EDA tools for timing, power, signal integrity, EM/IR analysis, static timing, and noise analysis. 5. Drive design verification and implement quality assurance methodologies for memory IP. 6. Define silicon test plans and provide support for post-silicon bring-up and debugging in collaboration with test teams. 7. Manage design projects by planning and organizing design resources, while addressing customer/client requests and events as they arise. 8. Work closely with cross-functional teams across global locations to ensure successful project execution. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16482&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As a platform engineer, you will focus on designing, implementing, and maintaining scalable features and services on the platform to support the productionization of applications that support the company’s R&D/Fab/Business/IT/Security functions to improve the productivity and work quality. Job Responsibilities: Your responsibilities include: 1. Automation and Scripting (1) Develop and maintain automation scripts for configuration, monitoring, and management using tools such as Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. (3) Implement Infrastructure as Code (IaC) to automate resource provisioning and CI/CD workflows. 2. Application Development (1) Develop scalable cloud-native microservice architectures for IT applications. (2) Develop state-of-the-art applications and refactor existing ones to improve performance and maintainability. (3) Apply software design principles, such as 12-factor app, to ensure sustainability and quality. (4) Write and implement tests (unit/feature/integration) to guarantee software integrity. 3. Monitoring and Troubleshooting (1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Conduct root cause analyses and apply corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Lead evaluation and adoption of new IT technologies for continuous improvement. 4. (Optional) Network Design and Management (1) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy. (2) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only) On-call needs: On-call 1 week every 3 months The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test (which could be replaced if you have script of an official English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=555&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking outstanding engineers to join TSMC IT infrastructure team to build and operate IT advanced Data Center to support world-class semiconductor foundry. This team is responsible for designing, implementing and optimizing IT infrastructure towards software-defined computing, storage and networking with advanced cloud technologies. The successful candidate should have strong technical skills and dedication for operation excellence. Job Responsibilities: Your responsibilities include: 1. Network/Storage Design and Management: (1) Design, construction, operation, and capacity planning of large-scale NAS storage/object storage. (2) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy. (3) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. 2. Automation and Scripting: (1) Develop and maintain automation scripts for network configuration, monitoring, and management using tools like Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. 3. Application Development: (1) Develop state-of-the-art applications and refactor existing applications for improved performance and maintainability. (2) Write and implement tests (unit/feature/integration) to guarantee software integrity. 4. Monitoring and Troubleshooting: (1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Perform root cause analysis and corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Infrastructure operation issues(network/server/storage/security) visualization and countermeasure planning. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only) On-call needs: On-call 1 week every 3 months 1. Manager interview 2. Hackerrank test 3. On-site personality and English test(which could be replaced if you have script of an official English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16521&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking a highly motivated and talented R&D Engineer to join our team in developing advanced IC packaging technologies. This position offers an exciting opportunity to work on cutting-edge solutions, such as CoWoS (Chip-on-Wafer-on-Substrate), Fan-Out Wafer Level Packaging (FOWLP), and 3DIC (Three-Dimensional Integrated Circuits). The ideal candidate will have strong technical expertise and a passion for innovation in semiconductor packaging design and analysis. Join us in shaping the future of advanced IC packaging technologies and contributing to groundbreaking innovations in the semiconductor industry. This role provides a unique opportunity to work in a dynamic environment, solve challenging engineering problems, and make a meaningful impact on next-generation packaging solutions. Responsibilities: 1. Conduct risk assessments and provide mitigation plans for IC packages through simulation and experiment, interpreting experimental data and simulation to provide insights into material selection and design improvements. 2. Practice FEM and DOE in problem solving and path finding particularly on packaging. Conduct mechanical or thermal simulations using finite element analysis (FEA) techniques to evaluate and optimize packaging performance, and analyze stress, deformation, and heat dissipation characteristics to ensure reliability and efficiency of packaging designs. 3. Continuously improve simulation methodology, refine material modeling, and enhance script automation capabilities. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16577&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師：為守護客戶產品不受任何缺陷影響，建立優良的產品品質與可靠度，以協助客戶在市場上搶得先機、強化競爭力；QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法，應用於我們的產線，確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案，同時提供最先進的材料與故障分析等服務，成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis, manufacturing production quality management and reliability assessment, research, and development of new analysis protocol. 3. Customers problem resolving for production quality / reliability issues. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16576&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency, and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluate next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.),which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.