清大專區

1. 規劃/設計開發板 (EVK)的規格, 電路, 以及PCB layout 2. 電源架構設計，包含制定規格和電路設計/驗證 3. 調研客戶產品需求以及競爭力分析 4. 全球客戶專案管理以及技術支持

1. Develop systematic methodology to alleviate design challenges, including synthesis, physical implementation, Timing/IREM sign-off, process what-if assessment, system performance evaluation, in advanced nodes or package 2. Closely work with foundry and EDA vendors to define innovative HPC, Chiplet design methodologies 3. Explore new circuit architecture, EDA features and define improvement direction from MTK product requirements

我們正在尋找一位技術精湛的相機ISP演算法開發工程師加入我們的團隊， 理想的候選人將負責設計、開發和優化相機系統的影像信號處理（ISP）演算法， 主要職責包括開發演算法提升影像質量、減少噪聲和改善色彩準確性。 候選人應具備影像處理、電腦視覺的強大背景，並熟練掌握C/C++和Python等編程語言， 具有相機硬體和實時處理經驗者優先。 加入我們，一起創新，推動相機技術的極限！

1. Design and RTL implementation of SoC debug modules 2. Integration and verification of debug components (e.g., trace, monitor, access port) 3. Debug signal capture, trace, and analysis for SoC platforms 4. BUS topology and debug mechanism circuit design 5. Support SoC debug flow and issue localization 6. Collaborate with cross-functional teams to optimize debug performance 7. Documentation and test specification for SoC debug features

1. 5G modem 架與數位電路設計 2. CLK, 測試, Reset相關設計與規劃 3. 低功耗設計 4. 系統整合 RTL 到 Gate level, 含STA

1. Perform pre-silicon and post-silicon correlation and modeling related to adaptive voltage scaling and on-die sensor 2. Develop and improve post-silicon testing methodologies related to adaptive voltage scaling and on-die sensor

* 資深SI/PI工程師 * 封裝/電路板 SI/PI設計與晶片開發於消費型產品, 車用以及企業級高效運算產品 * 記憶體以及高速Serdes SI/PI設計 * 高效能CPU/GPU/APU PI以及PDN設計 * 建立封裝/電路板的高速序號設計準則, PDN電氣規格, 以利產品進行

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek: * Scan chain insertion & ATPG pattern generation * Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.) * Diagnosis to help manufacture process improvement 2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC: * PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation * Develop & integrate DFT-related RTL design modules to test chip

1. FR-1 平台天線解決方案開發與驗證 2. 使用EM模擬軟體進行天線解決方案性能評估 3. 與跨部門團隊合作開發新MTK平台天線解決方案

1. CPU system design and performance analysis 2. System bus architecture and integration 3. IP and system verification

1. CPU system design, Power, performance and Area analysis 2. MCUSYS u-Architecture design 3. AMBA System bus architecture and integration

根據不同專案使用的各種CPU架構: * Function validation * Margin characterization & validation * System stability validation * Power/VF/Benchmark characterization * Customer issue resolve

1.數位電路設計 2.多媒體架構與電路設計 3.多媒體系統整合 1.Digital IC Design 2.Multimedia Architecture and Design 3.Multimedia System Integration

解讀客戶的網絡安全需求 從網絡安全需求中推導出功能和安全概念 制定和審查安全系統架構 與 IP 團隊和客戶溝通和協調安全設計 執行系統安全分析（例如：TARA）

1. 高速Serdes系統技術開發(200Gbps+), 包括電通訊與光通訊(optical interconnect) 2. 定義系統技術規格並與設計團隊(Analog, Digital, Algorithm)討論系統架構, 建立模型模擬評估 3. Serdes 關鍵技術評估與開發( e.g., Next Gen Serdes, optical nonlinearity compensation, CPO technology) 4. 協助Serdes IP驗證問題分析

•重點開發技術: 系統軟韌體開發、高速資料實體層(physical layer) 資料傳輸軟體開發、優化硬體效能及產品量產品質控管 •主要目標: 完成Enterprise/AI/xPU等相關產業客製化IC的軟韌體開發與系統整合，並協助客戶產品量產 •負責新產品的系統設計與開發，確保符合公司及客戶的需求 •協助量產過程中的技術問題解決，並提供專業建議以提升生產效率與品質 •與跨部門團隊合作，確保產品從設計到量產的順利過渡 •分析並改善現有系統和流程，以提高產品質量和生產效率 •參與產品測試和驗證，確保產品符合相關標準和規範

1. Own the top-level integration of internal and third-party IPs into SOC or FPGA platform. 2. Ensure interface compatibility, clock/reset domain correctness. Resolve integration issues including timing, CDC/RDC, and floorplan. 3. Work closely with architect to define specification, support physical design team through synthesis constraints and integration guidance, partner with firmware and validation teams to ensure smooth bring-up and validation.

-規劃並執行高速介面（如 PCIe, USB, DP, UFS, CSI, UCIe）IP PHY 驗證。 -建立並維護測試平台，進行 System 與 Electrical 測試。 -使用 Scope, BERT, LA, Signal Analyzer 等儀器進行 Signal Integrity 與 Compliance Test。 -分析測試結果，協助 DE 及 SW 團隊解決問題。 -設計並開發硬體 PCB 評估板，支援系統驗證。

1. Automotive Packaging development, New product introduction, Mass production, Supplier management.​ 2. Develop and evaluate the advanced IC Package technology.​ 3. Collaborate with the assembly subcontractors to complete the technology development.​ 4. Qualification and yield improvement for the advanced IC Packages.​ 5. Audit subcontractors.

1.Propose design verification plan and do the execution based on IP and system HW architecture/application 2.Develop design verification environment 3.Develop required verification methodology and adopt into project