交大專區

Product 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadmap, package memory architecture , customized HBM development

負責新產品開發、產品製造管理、良率改善，及產品開發時的問題分析及解決。

Do you want to be part of a smart and passionate team of researchers, advancing artificial intelligence to the next level of end-user experience in their daily lives? MediaTek is seeking driven and brilliant young students to join our efforts by providing Internship placements. We are currently working to expand the frontiers of Deep Learning frameworks for Computer Vision and Natural Language Processing and we hope you can join us! The ideal candidate is open-minded, passionate about learning theory, and looks forward to both practical and challenging problems. • You will be working towards or recently have completed a PhD in a quantitative field such as Computer Science, Mathematics, Physics or Engineering. • You have a good knowledge of the foundations of Deep Learning and Neural Networks, including some experience with Machine Learning frameworks (Tensorflow, PyTorch, JAX) • You are a proficient scientific communicator. You are committed to your goals and working in a team. • You are eager to tackle the state of the art problems in the field. We want your ideas to shine! As a Deep Learning Researcher in our team, you will collaborate with our Researchers and with worldwide colleagues, stay up and above the state of the art, initiate with novel ideas, and develop them into algorithms and applications that make the real difference in everyday devices. You will also push your contribution by publishing at top-tier conferences, such as NeurIPS, ICML, ICLR, CVPR, ACL, ICRA, ACM.

1. 開發emulation/prototyping 相關的技術及使用流程 2. 建立CPU/GPU emulation/prototyping 驗證平台 3. 協助project team導入emulation/prototyping 技術 4. emulation/prototyping 使用及工具問題的支持 5. 管理 emulator 及prototyping 硬體與使用分配

• 新產品導入量產 (IC 封裝部分) • 良率持續改善 • 解決製程異常, 工程問題 • 技術開發與製程改善

As an Digital IC Design Intern, you will collaborate with our researchers and worldwide colleagues and develop applications and algorithms that make a real difference in everyday devices. Your developments would significantly enhance the experience of numerous end users across our product range.

1. Define power states and management hardware architecture for optimal power performance. 2. Design microprocessor-based power management controller and HW assistance designs. 3. Define power architecture by performing power rail tradeoff analysis with adaptive voltage scaling consideration

We are seeking skilled engineers for designing high-performance Virtualization and Interconnect Architecture and developing RTL for both Automotive and High-Performance Computing. Roles: 1. Develop, assess, and refine RTL to achieve performance, power, area, and timing goals. 2. Develop micro-architecture by exploring early high-level macro architectures, researching micro-architecture, and defining detailed specifications. 3. Coordinate co-design efforts between architecture, software, and hardware teams to achieve functional realization. 4. Develop and implement interconnect methodologies, such as simulation, emulation, implementation, and efficiency improvement.

1. Implement and maintain device drivers, or firmware for high-speed interfaces, such as PCI Express, MIPI CSI-2, USB or UFS. 2. Develop FuSa and security software framework for high-speed interfaces to fulfill automotive requirements.

1. Develop scalable platform clocking architecture for automotive SoC 2. Enhance SoC clock architecture and technology development to address the automotive SoC requirements 3. Drive clock architecture and designs to optimize power, performance, and implementation, including physical design and timing closure

1.Digital design (RTL design, Synthesis, integration, verification) 2.SoC Chip design, integration 3.Familiar with VLSI design flow is a plus

• 此職位屬於聯發科技modem客戶工程團隊，該團隊任務為與內部研發團隊合作，支援全球一流智能手機客戶的無線通訊技術(包括LTE、5G Sub-6GHz和5G mmWave技術)。 • 此職位主要職責在與客戶合作過程中帶領技術討論，並與內外部不同團隊合作，共同討論並解決客戶問題、滿足需求。 • 此職位需具備深入研究技術問題、了解客戶需求分析與功能開發的能力及良好應變能力。 • This is an exciting role in the MediaTek wireless technology group within the modem customer engineering team working with internal R&D team and support tier-1 global smartphone customers in wireless technologies (LTE, 5G Sub-6GHz, and 5G mmWave technologies) • You will play a key technical role in working with internal and external stakeholders to lead technical discussion and drive customer issues to resolution. • This is a dynamic position that will interact and collaborate with different teams and site location. • Ability to deep dive technical issues, understand customer requirement analysis and feature development. Looking for 4G/5G Modem Protocol / System Engineer with technical breadth in the protocol stack.

1. Work with design teams to do performance sign off in pre-silicon stage 2. ESL platform and simulation/emulation technology development. 3. Model development (includes behavior modeling/ cycle approximate modeling)

1.PCB 電路及layout 的設計及驗證 2. 客戶端平台之開發驗證

系統架構模擬, 達到 性能/功率/面積分析

1. 支援客戶產品的開發 2. LCD Monitor 或Retimer FW的開發與應用 3. 協助產品的推廣 4. LCD Monitor UI 的設計 以及訊號的處理

1. Baseband algorithm development. 2. Ethernet PHY system architecture and algorithm design. 3. Communication system verification. 4. Architecture/algorithm design for low-power and high-speed communication system. 5. Digital signal processing of mixed-signal system.

跨團隊合作(如:數位設計,系統應用, 測試, 製程...)以最佳化系統單晶片/平台競爭力及效能 ‧ 基於類比設計技術背景, 與類比設計團隊合作提供混合信號解決方案或IP, 以最佳化系統單晶片/平台競爭力及效能. 於計畫開發過程中, 協調類比團隊共同解決相關問題及克服挑戰, 以達成量產目標

1. Work on 3~7nm design implementation, methodology, and sign-off 2. Perform synthesis, DFT, floorplan, clock planning, place and route, timing closure, ECO, IR signoff, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution

IC 產品發展, 產品量產管理與良率改善, 除錯與問題的解決