交大專區

1. HW platform系統電路設計及系統應用 2. PMIC or PCIe or USB 系統電路設計 3. SoC參考電路設計及驗證 4. 協助客戶量產過程時提供技術支援

1. 5G NR通訊系統分析 (a) 5G NR實體層規格及流程驗證 (b) 基頻演算法設計驗證及訊號分析 (c) 整體系統效能驗證與流程分析 2. 5G NR通訊平台開發 (a) 內部測試平台開發 (基本功能,算法) (b) 系統性能以及RRM分析平台開發

8+ years experiences in IC Advance Package Design such as 3DIC Development, ASIC (APR) design, flow development, and EDA enablement KEY RESPONSIBILITIES: 1. Contribute to the development and enhancement of design methodologies for 2.5D and 3D IC advanced package design. 2. Lead the development of new design and signoff flows for physical, electrical, and thermal quality assurance. 3. Support package design teams in defining a tool roadmap for advanced package design. 4. Contribute to interposer designs, advanced package designs, and test vehicles for the product design roadmap and feasibility. 5. Represent the Package design team in customer engagements for advanced package designs.

* 根據積體電路設計流程、半導體器件、良率提升等相關知識進行數據分析 * 建立人工智慧框架與工作流程，以提升數據運營與分析的生產力 * 與不同的內部及外部團隊溝通協作，提出策略建議

IC設計: 晶片整合 IP開發

SOC Pre-Silicon 平台技術, 流程方法, 參考設計開發

The candidate will conduct functional verification of the RF transceiver circuit design at various stages—from individual circuit blocks to the complete system operation—using behavioral models during the design process.

1. FR1/FR2/FR3射頻收發機設計 2. 低雜訊放大器, 混頻器, 訊號源產生器, 放大器鏈, 功率放大器設計 3. 低功耗射頻電路設計 4. 射頻設計方法及整合流程優化

• 領導並參與6G無線通信技術的前沿研究工作。 • 為國際標準組織（如3GPP）制定和完善技術提案。 • 分析新興趨勢，並將前沿概念（如人工智慧、能源效率、衛星通信）納入研究議程。 • 與跨領域團隊合作，評估技術的可行性及其與全球標準的契合度。 • 透過參與全球聯盟、產業論壇及標準化委員會，推動生態系統的互動與參與。 • 指導初級工程師標準化流程及技術寫作。

1. Automotive Packaging development, New product introduction, Mass production, Supplier management.​ 2. Develop and evaluate the advanced IC Package technology.​ 3. Collaborate with the assembly subcontractors to complete the technology development.​ 4. Qualification and yield improvement for the advanced IC Packages.​ 5. Audit subcontractors.

1. 應用於I/O 小晶片的 SerDes 設計驗證工作. 包含從原型測試到量產晶片, 並與類比, 數位, 演算法設計團隊和系統應用團隊合作. 2. 負責實現測試腳本或設計測試韌體, 以驗證SerDes 類比IP和物理層效能. 3. 負責建立自動化測試程式和資料分析, 以測試SerDes 類比IP和物理層效能的特性和失效分析

1. AI 處理器系統架構/微架構設計 2. AI 處理器系統 BUS 與 memory, power/clock/reset 控制電路及其周邊相關電路設計 3. 車用安全性相關設計

1. 先進SoC晶片設計整合 2. 先進製程 IC 設計實現與技術開發 3. 關鍵 IP RTL-2-GDS 技術開發

• Perform 5G/B5G/6G/NTN baseband algorithm designs, including (but not limited to) system analysis, beamforming mechanisms, calibration methodologies, RF exposure control, etc. • Perform ML/AI algorithm investigations and seek potential applications for system performance optimization. • Be able to guide junior engineers if applying for technical manager. • Be able to coordinate multi-site operations and attend meetings across time zones (nice-to-have)

1.Propose design verification plan and do the execution based on IP and system HW architecture/application 2.Develop design verification environment 3.Develop required verification methodology and adopt into project

Machine Learning - Architect/Researcher/Engineer - Accelerator, Deployment and Infrastructure [Overview] MediaTek HQ is looking for Machine Learning Architect, Researcher, or Engineer who is passionate about System Platform, Software Engineering, and Applied Machine Learning (including Deep Learning and AI). This position is within MediaTek’s AI Group. This R&D role offers a dynamic environment, hands-on learning, and a unique opportunity to develop both Infrastructures and Accelerators for state-of-the-art (SOTA) machine learning, as well as to build applications utilizing SOTA machine learning techniques. You will join a team devoted to developing and deploying cutting-edge machine learning and deep learning algorithms, optimized for MediaTek’s NPU—and, conversely, optimizing our NPU for advanced ML/DL workloads.

1. Wi-Fi 驅動程式和韌體開發設計及驗證 2. Wi-Fi 等無線晶片之跨層架構介面設計 3. 開發並取得Wi-Fi Alliance認証 4. 移植WLAN驅動程式到各Android, Linux核心和手機產品 5. 協助研發軟體新技術與新工具 6. 維護量產的產品

1. Clock架構與RTL設計 2. SOC IOMUX架構與RTL設計 3. SoC Floorplan架構規劃 4. 旗艦智慧型手機晶片整合 5. 車用系統晶片整合

1. CPU system design and performance analysis 2. System bus architecture and integration 3. IP and system verification

無線網通晶片設計/整合/驗證