交大專區

1.經營辦公室自動化數位商品：數位交換機/電話系統、門禁/監控系統、視訊會議系統、HR人資系統、數位多功機、數位彩色/黑白影印機、速印機、3D印表機、Office Win(辦公雲)、印量管理系統、圖文管理系統等商品。 2. 主要為B2B方式，開發轄區客戶，開拓新市場。 3. 顧客關係維繫，發掘顧客需求，提供系統性規劃顧問式銷售。 4. 機會均等、人事公開，升遷透明快速肯定人才。 5. 前3個整月保障薪資40K。 6. 工作待遇為新人平均月薪資，另有高額獎金。 我們有完善的教育訓練，提供您最佳舞台，讓您實現理想成就未來，在職場上出類拔萃，成為耀眼明日之星！ 關於互盛，歡迎透過官方網站了解更多 www.eosasc.com.tw

1. 系統板材裁切、膠合封邊帶等相關傢俱工廠機台操作。 2. 板料加工 , 無經驗者亦可。 3. 公司制度完善，工作穩定，另有工作獎金。

1.SPEC之繪製 2.加工圖面繪製 3.示意圖繪製 4.客戶設計規則之訂定 5.產品組裝確認/量測 熟AUTOCAD與SOLIDWORKS尤佳

1.電器/空調維修 2.維護修繕空調設備，需留意冷卻劑之保存、回收、再利用

1. 生產設備研發、設計與改善。 2. 協助生產技術、製程改善。 3. 機械維修與保養計畫。 4. 其他主管交辦事項。

1. 2D工程圖繪製及3D模型建立 2. 協助部門事務處理、其它臨時交辦事項。

１. 檢查工件藍圖和規則 ２. 撰寫CNC(數位控制機床)的電腦程式，並把機械繪圖透過CAD/CAM輸出電腦數值控制碼 ３. 數位控制銑床機台操作，包含架模、準備刀具、對刀座標軸，進行平面、銑曲面、銑溝槽、銑齒輪、銑種種複雜的形狀加工，依照切割材料的硬度和特性選擇合適刀具，將刀具安裝在床機上 ４. 從事機械各類加工、表面處理，過程中需要將零件進行裝配，使用螺栓、夾板等工具固定欲切割削磨的物件，並操作各種機械工具 ５. 決定切削的速度並啟動銑床機試切，操作手輪或以自動進刀方式進行加工 ６. 負責產品測試與量測，協助改善製程品質與追蹤 ７. 具識圖能力 ８. 熟CNC電腦銑床程式、刀具選用者佳 ９. 具學習熱忱、配合度高、工作態度認真、細心、積極者，歡迎您的加入！！ **需有CNC銑床經驗者**

1. 資訊基礎架構建置與維護 2. 資安系統建置與維護 3. DBA 4. 資訊設備維修 *兩年以上 Linux 管理經驗 *兩年以上 DBA 實務經驗 *預計2026年中，總部從永康遷往歸仁，地址為台南市歸仁區沙崙里高發三路二段160號。

1.負責業務技術支援與模具報價 2.負責模具規格書編制與開模分析報告 (DFM) 3.主導模具設計與製造方案, 以達成品質與成本目標 4.負責模具開發進度追蹤與跟催, 以達成交期目標 5.主導試模檢討與修改方案 6.負責處理客戶端驗收處理 7.其他上級主管交辦事項

1.負責業務技術支援與模具報價 2.負責模具規格書編制與開模分析報告 (DFM) 3.負責處理模具設計與製造方案, 以達成品質與成本目標 4.負責模具開發進度追蹤與跟催, 以達成交期目標 5.負責處理試模檢討與修改方案 6.負責處理客戶端驗收處理 7.其他上級主管交辦事項

長年訂單穩定，收入有保障。 如果你正在找一份能穩定發展的工作，歡迎加入我們! 【你在意的，我們都有顧到！】 ・作息穩定：固定班別免輪班，依照政府行事曆休假。 ・加班保障：加班費依法給付，公司再額外加碼補貼餐費。 ・實質回饋：年終獎金與三節禮金／禮品。 ・環境單純：團隊氣氛和善、無小團體，溝通直接最有效率。 ・表現看得見：工作態度佳、能力持續提升，公司會依表現給予調薪與發展機會。 ・新人好上手：由資深同仁帶領熟悉工作內容，循序漸進學習作業流程。 【工作內容】 1.不鏽鋼產品氬焊組立作業（依圖面獨立施工）。 2. 依工作需求完成主管交辦事項。 3. 視訂單需求配合加班。 【具備條件】 1.氬焊相關經驗（焊接0.8T～2T)，具板金組立經驗者佳。 2.能獨立完成成品品質檢驗確認。 3.態度積極、具責任感。 4.能配合現場作業與團隊合作。 【工作時間】 ・週一至週五 08:00－17:00（中午休息 1 小時） ・休假制度 週休二日，依政府公告國定假日休假。 【福利制度】 ・年終獎金 ・三節禮金／禮品 ・加班餐費補貼 ・不定期聚餐與點心分享 ・免費咖啡機與咖啡豆供應 ・飲水機、冰箱、微波爐等設備完善 【我們希望找到這樣的夥伴】 不論是否具備相關經驗，只要願意學習、工作態度積極、具備責任感，並能與團隊互相配合，我們都歡迎你的加入。 【關於我們】 公司重視每位同仁的想法與感受，致力打造穩定、友善且願意一起成長的工作環境。除了把工作做好，也希望讓每位同仁都能在良好的工作環境中安心發展，獲得工作成就感。 歡迎投履歷來信洽詢預約面試時間，期待您的加入！

1.AS文件維護與整理 2.鼎新ERP及SFT操作 3.執行工程師交辦事項 4.圖資管理 5.學習並協助使用電腦繪圖軟體 (會AUTO CAD基礎即可)

- Data analysis to ensure handler work on baseline. Ex. MCBA, index time, temperature control and HW interface maintenance 資料分析確保機台運作在基準條件, 包含作動不順, 作動時間, 溫度控制, 及機台介面維護 - SOP, OCAP, PM document creation. 建立標準化流程,異常處理文件,及保養維護文件 - Responsible for the performance of handler. 負責機台性能及相關報告 - Handle the improvement project on handler. 持續進行機台的改善計畫 - Management recipes of handler and spare parts 機台參數管理及備品管理 - Provide technology and operation training to shift assistant engineer and operators in manufacture lines to support production smoothly. 訓練助理工程師與作業員以利生產線順利運作 - Co-work with worldwide handler team for evaluation/improvement 與其他機台團隊跨國合作, 導入評估, 問題改善

***Please upload English resume onto our official platform: https://reurl.cc/1bbx6m Job Descriptions - The selected candidate will participate in Wi-Fi/BT software/firmware design , implementation, integration, validation and maintenance phases for standard based and non-standard based Wi-Fi/BT/BLE products for IOT and automotive markets. - Lead/participate in complex feature integrations/enhancements, Wi-Fi/BT/BLE SoC bring up, and technical issue solving. - Research, design and develop cutting edge technologies for industrial features and IEEE/WFA/BT/BLE spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies. - Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting. Support customers remotely or onsite as needed. Qualifications - MS in EE, CE, or CS. - Proficient in C programming language. - Experience on Linux / Android programming is a plus - Knowledge on real-time OS (FreeRTOS / ThreadX) programming is a plus - Knowledge of ARM assembly is a plus - Team player and excellent interpersonal, communication and writing skills - Independent, self-motivated and willing to learn

Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

Role Summary: The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies, enabling new product creation company-wide. Job Responsibility: －Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications. －Establish qualification requirements for new technology and product introduction. －Perform rigorous statistical analysis of reliability characterization data. －Enable high reliability during volume production by working with product groups to address risk areas. －Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues. －Communicate study conclusions and recommendations to internal and external teams. Job Qualification: －Bachelor‘s, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 10 years of industry experience. －Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio). －Software development experience, such as familiarity with microcontroller software development (C/C++) is desired. －Interest in statistics and solid-state device fundamentals, especially as applied to emerging non-volatile memory technologies like MRAM and RRAM. －Must be curious, proactive, and detail-oriented. －Able to work in a team environment, communicate effectively in English and Mandarin, and solve problems.

Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing

The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor‘s or Master‘s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .

Please apply for this position on NXP official website: https://pse.is/836k2a Job Responsibilities: APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI). The key areas of responsibility of the jobholder are: 1. Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process 2. Front end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement. 3. Interface with key customers on critical projects. 4. Lead and steer the projects towards timely completion to support NXP business needs 5. Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc Requirements / preferences: 1. Bachelor or MSc in physics or electrical engineering. 2. ＞10 years of experience with front-end IC process integration, working in foundries’ production or development teams 3. In-depth knowledge of IC devices and processes. FinFET and NVM knowledge is a plus. 4. Strong understanding of yield enhancement techniques and data analysis 5. Must be fluent in English and Mandarin 6. Hands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up. 7. Good communication skills. Having the ability to influence and steer a discussion 8. Pro-active working attitude, creative, pragmatic, enterprising and result driven. 9. Familiar in managing/working with foundries, maximizing leverage from foundries