交大專區

1. 機械設備保養維修能力: 機械設備的日常保養與維修工作,確保設備運作正常 2. 問題診斷與修復 3. 設備保養週執行: 設備保養計畫,按計畫執行 4. 備品零件管理: 管理維修所需的備品零件, 管理清單與缺料時回報相關單位 5. 溝通協調能力: 能與團隊及客戶和主管有效溝通 6. 完成主管交付工作

1. 機械設備管線規劃設計 2. 機械設備管線建造督導 3. 安裝工程執行協調督導 4. 業主/公司/現場工作人員溝通協商

1. 機械設備保養維修能力: 機械設備的日常保養與維修工作,確保設備運作正常 2. 問題診斷與修復 3. 設備保養週執行: 設備保養計畫,按計畫執行 4. 備品零件管理: 管理維修所需的備品零件, 管理清單與缺料時回報相關單位 5. 溝通協調能力: 能與團隊及客戶和主管有效溝通 6. 完成主管交付工作

1. 負責儀電設備檢修、安裝、校正、保養及操作等工作。 2. 維持廠內儀電設備正常運作。 3. 線路故障排除修護。 4. 拉線及配電管工作。 5. 完成主管交付事項。

1. 負責儀電設備檢修、安裝、校正、保養及操作等工作。 2. 維持廠內儀電設備正常運作。 3. 線路故障排除修護。 4. 拉線及配電管工作。 5. 完成主管交付事項。

1.商用冷凍、冷藏冰箱、空調設備安裝工程與後續維修保養。 2.冷凍(藏)系統配線、配管。 3.可配合加班。 4.須具備冷凍空調裝修證照丙級(含)以上。

1.電梯設備保養維修、安裝 2.檢查電梯各種機具、電機的故障狀況 3.具相關科系，公司技能培訓 4.公司有良好的薪資及福利制度 需具備丙級以上昇降機裝修技術士證照者尤佳

1.停車設備/電梯保養與維修 2.協助客戶改善與解決問題 3.保養合約收送 需具備丙級以上昇降機裝修技術士證照者

1.電梯設備保養維修、安裝 2.檢查電梯各種機具、電機的故障狀況 3.具相關科系，公司技能培訓 4.公司有良好的薪資及福利制度 需具備丙級以上昇降機裝修技術士證照者尤佳

1.停車設備/電梯保養與維修 2.協助客戶改善與解決問題 3.保養合約之收送 具備丙級以上昇降機裝修技術士證照者優先考慮

1.協助工程管理：協助工務主管跟進施工進度、檢查工地現場，確保各項工作按計劃進行。 2.資料整理與報告：整理工程相關資料、製作報告及文件，並進行文書處理。 3.協助採購物資：協助工程所需材料、設備的訂購與管理。 4.現場檢查與測量：進行現場的基本檢查或測量工作，確保施工品質。 5.工程識圖及繪圖。 *建築相關科系佳

運用水電專業技術🔧，讓所有系統穩定運行，實現更高效的工程品質與安全標準！ 💼 工作內容： 1. 從事空調與水機電系統的規劃、設計與安裝，讓每一個空間都更舒適與可靠 2. 精準進行系統檢測、故障分析與維修，解決每一個挑戰 3. 檢視與提升設備性能，確保最佳效能與穩定性 4. 遵循相關法規與安全標準，維持施工品質與工地安全 5. 使用專業設備進行佈線、配電與安裝，展現高超技術

We are seeking a highly skilled and motivated AWS Cloud Infrastructure Engineer to design, implement, and manage our core AWS cloud infrastructure. You will be instrumental in automating our deployments, ensuring system performance, and leveraging ArgoCD for our GitOps workflows to maintain a robust, cost-optimized environment. Key Responsibilities ● Experience: 3+ years of hands-on professional experience working with AWS infrastructure at scale. ● AWS Services Expertise: Deep knowledge of core AWS services, including VPC, EC2, S3, RDS, Lambda, EKS/ECS, IAM, and Route 53. ● GitOps Proficiency: Strong, practical experience with ArgoCD for managing application deployments and synchronization. ● Kubernetes: Excellent working knowledge of Kubernetes (EKS), including writing custom resources, Helm charts, or Kustomize configurations. ● Scripting: Proficient in scripting languages such as Python or Bash. ● Networking: Strong foundational knowledge of networking concepts (TCP/IP, DNS, Load Balancing, Firewalls). ● Certification: AWS Certified Solutions Architect - Associate or AWS Certified Developer - Associate (or equivalent experience). If you are passionate about GitOps, excited by ArgoCD, and ready to build the next generation of scalable infrastructure on AWS, we encourage you to apply!

• 負責軟體產品需求定義與交付，確保產品符合業務目標與使用者需求 • 作為業務單位與開發團隊之間的橋樑，將高層策略轉化為可執行的產品需求 • 參與產品開發全流程，確保需求清晰、進度穩定與交付品質 如果你熱衷於透過數據與邏輯驅動產品成功，並希望參與高互動、快速成長的產品開發環境，歡迎加入我們！ ––- 📌 主要職責 1.需求分析與管理 • 蒐集、分析並管理功能與非功能需求（訪談／工作坊／文件分析） • 撰寫並維護 User Stories、Use Cases 與需求文件 2.文件與流程建構 • 製作產品相關文件（流程圖、Wireframe、Data Flow Diagram 等） • 與 UX/UI 團隊協作，完善產品設計與使用流程 3.跨部門溝通與協作 • 與各業務單位協調需求與優先順序，確保專案方向一致 • 管理利害關係人期待，確保需求與開發目標對齊 4.敏捷開發支持 • 在 Agile／Scrum 流程下管理需求與 Product Backlog • 定義驗收標準，並於開發過程中持續釐清需求 5.分析與解決方案 • 進行可行性分析、差距分析與影響評估 • 提出符合商業需求與技術限制的最佳解決方案 6.測試與驗證 • 與 QA 團隊合作制定測試計畫與驗收標準 • 確保交付成果符合需求與品質要求 ––- 📌 職務需求 • 3 年以上 Business Analyst／System Analyst／Product Owner 經驗（軟體或 IT 領域） • 熟悉 Agile／Scrum 開發流程 • 熟悉工具：Jira、Confluence、ClickUp、Xmind 等 • 具備優秀的溝通與簡報能力，能跨技術與非技術團隊協作 • 具備問題分析能力，能拆解複雜需求並提出解決方案 • 相關科系學歷（商業管理、資訊、資工等）

1.AS文件維護與整理 2.鼎新ERP及SFT操作 3.執行工程師交辦事項 4.圖資管理 5.學習並協助使用電腦繪圖軟體 (會AUTO CAD基礎即可)

- Data analysis to ensure handler work on baseline. Ex. MCBA, index time, temperature control and HW interface maintenance 資料分析確保機台運作在基準條件, 包含作動不順, 作動時間, 溫度控制, 及機台介面維護 - SOP, OCAP, PM document creation. 建立標準化流程,異常處理文件,及保養維護文件 - Responsible for the performance of handler. 負責機台性能及相關報告 - Handle the improvement project on handler. 持續進行機台的改善計畫 - Management recipes of handler and spare parts 機台參數管理及備品管理 - Provide technology and operation training to shift assistant engineer and operators in manufacture lines to support production smoothly. 訓練助理工程師與作業員以利生產線順利運作 - Co-work with worldwide handler team for evaluation/improvement 與其他機台團隊跨國合作, 導入評估, 問題改善

***Please upload English resume onto our official platform: https://reurl.cc/1bbx6m Job Descriptions - The selected candidate will participate in Wi-Fi/BT software/firmware design , implementation, integration, validation and maintenance phases for standard based and non-standard based Wi-Fi/BT/BLE products for IOT and automotive markets. - Lead/participate in complex feature integrations/enhancements, Wi-Fi/BT/BLE SoC bring up, and technical issue solving. - Research, design and develop cutting edge technologies for industrial features and IEEE/WFA/BT/BLE spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies. - Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting. Support customers remotely or onsite as needed. Qualifications - MS in EE, CE, or CS. - Proficient in C programming language. - Experience on Linux / Android programming is a plus - Knowledge on real-time OS (FreeRTOS / ThreadX) programming is a plus - Knowledge of ARM assembly is a plus - Team player and excellent interpersonal, communication and writing skills - Independent, self-motivated and willing to learn

Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

Role Summary: The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies, enabling new product creation company-wide. Job Responsibility: －Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications. －Establish qualification requirements for new technology and product introduction. －Perform rigorous statistical analysis of reliability characterization data. －Enable high reliability during volume production by working with product groups to address risk areas. －Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues. －Communicate study conclusions and recommendations to internal and external teams. Job Qualification: －Bachelor‘s, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 10 years of industry experience. －Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio). －Software development experience, such as familiarity with microcontroller software development (C/C++) is desired. －Interest in statistics and solid-state device fundamentals, especially as applied to emerging non-volatile memory technologies like MRAM and RRAM. －Must be curious, proactive, and detail-oriented. －Able to work in a team environment, communicate effectively in English and Mandarin, and solve problems.