交大專區

1. 針對不同產品（智慧型手機/汽車/...）進行互連IP/Fabric IP/系統級快取IP/相關匯流排子系統設計 2. 與設計驗證團隊合作，確保功能性 3. 與效能驗證團隊合作，確保滿足效能要求（頻寬/延遲） 4. 執行IP設計品質控制流程（lint、CDC、Spyglass DFT、UPF等） 5. 執行RTL前端流程（SDC品質檢查、時脈約束檢查等）

1. Clock架構與RTL設計 2. SOC IOMUX架構與RTL設計 3. SoC Floorplan架構規劃 4. 旗艦智慧型手機晶片整合 5. 車用系統晶片整合

1. 針對各類 benchmark 進行分析，辨識性能瓶頸、功耗瓶頸，並評估熱管理機制之影響。 2. 建置並實作 benchmark 之系統模型，以評估 SoC 最佳化之可行性與潛在效益。 3. 持續追蹤不同平台 benchmark 之最新進展，聚焦於系統層級之改善方向與策略。 4. 彙整分析與建模結果，提出具可落地性之系統/SoC 最佳化建議，並與跨部門團隊協作推進改善與成效驗證。

1. 優化相機、影音播放與編輯等多媒體架構，最大化系統效能與使用者體驗。 2. 分析 SoC 效能瓶頸並執行系統調優，提出軟硬體架構優化策略。 3. 建立 SoC 異質運算（CPU/GPU/ISP/NPU）系統模型，探索並驗證最佳化方案。 4. 提供效能分析報告，向決策團隊提出技術發展與架構演進方向。

1. 運算架構開發研究與競爭分析 2. 系統單晶片的軟硬體行為之 效能/功耗 分析與最佳化 3. CPU/GPU/NPU系統模型設計與開發

1. 面板傳輸規格介面技術開發 2. TCON傳輸規格介面技術開發

1. AI處理器和相對應周邊IP/系統驗證環境開發 2. 從IP到系統的功能驗證和自動化環境 3. 開發低耗電和效能的測試 4. post-sillicon除錯 5. emulator 環境建立

我們正在招募一位熟悉生成式AI技術且擅長前端數位設計的工程師。本職缺專注於運用前沿商業或開源 LLM，於RTL設計、RTL優化、simulation testbench生成、formal testbench 生成等數位設計流程，開發提升設計自動化與效率之 AI 演算法。您將與RTL設計工程師、DV驗證工程師與AI專家合作，共同推動數位設計智能化。另外, 您也會研讀期刊,開發並評估效果, 並撰寫技術文件,專利或paper投稿.

歡迎同學提前投遞履歷爭取機會至景碩科技面試，畢業前即拿到科技業OFFER！ ★請備註欲應聘職缺優先序；我們將依照您的志願順序進行媒合 ▍招募職缺： 【製造工程師】 1.協助規劃產品流程所需技術及設備參數評估 2.製程生產參數之測試及驗證 3.製程能力及製程管制規格制定 4.製程良率改善及提升 【製程工程師】 1.製程改善、製程效率提升 2.製程異常排除 【自動化設備工程師】 1.自動化生產設備故障及卡板等例行性分析與改善 2.預防性保養及巡檢機制的執行管理 3.自動化設備改善專案之研擬與執行 ☺可至活動攤位洽詢詳細職缺說明，或依照學經歷安排適合職務面談 ▍應徵方式： 直接投遞1111專區，初步審核通過後將電話或email通知。 校園徵才活動當天至攤位瞭解景碩職缺並投遞履歷，即可獲得抽獎資格~~ 工作地點： 1. 桃園石磊廠：桃園市新屋區中華路1245號 2. 桃園清華廠：桃園市新屋區中華路810號 3. 桃園幼獅廠：桃園市楊梅區高獅路580號

韌體應用團隊負責支援 MediaTek 顯示器專案中的 Scaler SoC。 主要職責包括： 1. 協助客戶實現顯示器功能與相關應用 2. 釐清或除錯客戶專案中的問題 3. 於客戶端現場與客戶協同進行專案開發

1. Serdes/High speed interface related PHYD IP architecture planning. 2. Serdes/High speed interface related PHYD IP RTL coding. 3. Serdes/High speed interface related PHYD IP front-end and back-end integration. 4. Co-work with MAC design team and DV team for IP verification. 5. Co-work with Analog design team for PHY co-simulation.

1. HSI IP development 2. Short term: Help integration of on-going project including QC. 3. Long term: Deep learn into 3rd party HSI IP. Know the detailed spec of PCIe/UCIE/USB4 and able to co-work with DV.

1. Define power states and management hardware architecture for optimal power performance. 2. Design microprocessor-based power management controller and HW assistance designs. 3. Define power architecture by performing power rail tradeoff analysis with adaptive voltage scaling consideration

We are seeking skilled engineers for designing high-performance Virtualization and Interconnect Architecture and developing RTL for both Automotive and High-Performance Computing. Roles: 1. Develop, assess, and refine RTL to achieve performance, power, area, and timing goals. 2. Develop micro-architecture by exploring early high-level macro architectures, researching micro-architecture, and defining detailed specifications. 3. Coordinate co-design efforts between architecture, software, and hardware teams to achieve functional realization. 4. Develop and implement interconnect methodologies, such as simulation, emulation, implementation, and efficiency improvement.

1. Implement and maintain device drivers, or firmware for high-speed interfaces, such as PCI Express, MIPI CSI-2, USB or UFS. 2. Develop FuSa and security software framework for high-speed interfaces to fulfill automotive requirements.

1. Work on 3~7nm design implementation, methodology, and sign-off 2. Perform synthesis, DFT, floorplan, clock planning, place and route, timing closure, ECO, IR signoff, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution

• Define GPU compiler software architecture and interfaces. • Development/implement GPU compiler pipeline, linking and various optimizations/transformations. • Collaborate with Driver team, HW team to implement new API & HW features. • Collaborate with Driver team, HW team to improve/tune performance & power consumption. • Execute & deliver to meet milestones/schedules. • Analyze and debug code generation issues. • Construct reliable & trustable relationships across teams internally & externally.

Work in Analog/Mixed-Signal Modeling and Verification Methodology Development group to establish, streamline and enhance new and existing AMS Behavioral Modeling related development method, coding and validation process and integration flows, and work hands-on with AMS IP Teams for AMS Behavioral Modeling flow and process experiments, demonstrations, adaptions, and deployment. The candidate will work with AMS IP teams including digital design, analog design, analog behavioral modeling and design verification members, apply and advance existing and evolving AMS Behavioral Modeling methodologies and processes, and contribute to establish and maintain Modeling Platform to ensure High Quality and High Efficiency of Pre-Si AMS Modeling, Validation and Verification delivery towards high quality silicon products. • Work in methodology development group to establish, streamline and enhance new and existing AMS Behavioral Modeling related development method, coding and validation process and integration flows. • Work with teams to enable deployment of new AMS Behavioral Modeling flow and processes through experiments, demonstrations, adaptions (for real projects in specified areas such as RF, etc) and integration. • Document on new flows and processes for AMS Behavioral Modeling. • Apply wide range of AMS Behavioral Modeling skills to help and support AMS IP or Chip Teams to establish or enhance new or existing Modeling capabilities, including but not limited to Model Development, Model Validation to ensure Consistency of Behavior with Original Circuit, Integration of Models into various Verification Environment, fixing Modeling issues found in simulation, etc. • Contribute to continuous improving on AMS Behavioral Modeling process for better quality and efficiency through methodology and process improvements. • Communicate and collaborate with global architecture, design, verification teams to address new needs or requirement on AMS Behavioral Modeling. Job Locations: • Taiwan:Hsinchu/Taipei • India: Bangalore • Singapore • USA:Santa Clara, CA/San Diego, CA

• Work with the architecture/micro-architecture/design teams to do white box testing. • Create testplans based on the micro-architecture document with the design team. • Build, maintain and upgrade testbenches and their components using UVM-based methods. • Build custom BFMs for co-sim based module level verification. • Add assertions and checkers to facilitate verification. • Work with the design team to do module level formal verification. • Create controlled random testcases. Pre-debug and provide debug reports. • Check functional coverage and code coverage.

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek: * Scan chain insertion & ATPG pattern generation * Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.) * Diagnosis to help manufacture process improvement 2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC: * PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation * Develop & integrate DFT-related RTL design modules to test chip